Process condition sensing apparatus

An enclosure assembly, comprising:

• a top portion;
• and
• a bottom portion,
• wherein the top portion is detachably connectable to the bottom portion via one or more coupling devices, wherein the top portion is reversibly, electrically couplable to the bottom portion via one or more electronic contacts, wherein one or more electronic components are disposed within the enclosure assembly.

A process condition sensing apparatus, comprising:

• a substrate;
• an electronic assembly, wherein the electronic assembly includes one or more electronic components, wherein the one or more electronic components comprise:
• one or more processors;
• communication circuitry;
• memory;
• and
• a power source;
• an enclosure assembly, wherein the enclosure assembly comprises a top portion and a bottom portion, wherein the top portion is detachably connectable to the bottom portion via one or more coupling devices, wherein the top portion is reversibly, electrically couplable to the bottom portion via one or more electronic contacts, wherein the one or more electronic components of the electronic assembly are disposed within the enclosure assembly;
• and
• a sensor assembly communicatively coupled to the electronic assembly, wherein the sensor assembly includes one or more sensors disposed on the substrate at one or more locations across the substrate, wherein the one or more sensors are configured to acquire one or more measurement parameters at the one or more locations across the substrate, wherein the one or more processors are configured to receive the one or more measurement parameters from the one or more sensors, wherein the one or more processors are configured to stop receiving the one or more measurement parameters from the one or more sensors at a determined time.

A method, comprising:

• acquiring one or more measurement parameters using one or more sensors disposed on a substrate at one or more locations across the substrate;
• receiving the one or more measurement parameters from the one or more sensors using one or more electronic components of an electronic assembly within an enclosure assembly, wherein the enclosure assembly comprises a top portion and a bottom portion, wherein the top portion is detachably connectable to the bottom portion via one or more coupling devices, wherein the top portion is reversibly, electrically couplable to the bottom portion via one or more electronic contacts;
• and
• generating one or more control signals at a determined time to switch the operating conditions of the one or more electronic components of the electronic assembly, wherein after the determined time the one or more electronic components of the electronic assembly stop receiving the one or more measurement parameters from the one or more sensors.