G05B 2219/32114
Part type selection, for simultaneous processing
G05B2219/32114 (Part type selection, for simultaneous processing) appears on 3 US grants and 6 published applications in this corpus.
Search patents in G05B- Granted patents
- 3
- Published applications
- 6
- Assignees
- 5
- Inventors
- 15
- Latest grant
- 18 Oct 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2008 | 0 | 3 |
| 2009 | 2 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Process for selecting surrogate part18 Oct 2011US 8,041,442 B2Toyota Motor Engineering & Manufacturing North America, Inc.
- Automated sputtering target production14 Jul 2009US 7,561,937 B2Tosoh SMD, Inc.
- Automated sputtering target production and sub systems thereof27 Jan 2009US 7,480,976 B2Tosoh SMD ETNA, LLC
- Inspection Management System and Method6 Aug 2026US 2026/0227772 A1Hitachi High-Tech Corporation
- Extraction of a foundation fieldbus device information for enhanced device selection and data validation30 Aug 2012US 2012/0221126 A1General Electric Company
- Process for selecting surrogate part27 Jan 2011US 2011/0022210 A1Toyota Motor Engineering & Manufacturing North America, Inc.
- Automated Sputtering Target Production6 Nov 2008US 2008/0271305 A1Tosoh SMD ETNA, LLC
- Automated Sputtering Target Production11 Sep 2008US 2008/0221721 A1Tosoh SMD ETNA, LLC
Most cited
By later US patents