G05B 2219/32078
Calculate process end time, form batch of workpieces and transport to process
G05B2219/32078 (Calculate process end time, form batch of workpieces and transport to process) appears on 8 US grants and 6 published applications in this corpus.
Search patents in G05B- Granted patents
- 8
- Published applications
- 6
- Assignees
- 9
- Inventors
- 25
- Latest grant
- 15 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 2 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 0 | 0 |
| 2024 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method, device, and non-transitory computer readable medium for determining timing of removing substrate from cassette in substrate processing device, and substrate processing device15 Oct 2024US 12,119,246 B2Ebara Corporation
- Lamination planning method for laminate molded object, and laminate molded object manufacturing method and manufacturing device21 May 2024US 11,989,004 B2Kobe Steel, Ltd.
- Processing instructing device, processing instructing method, computer program and processing device4 Jul 2017US 9,696,711 B2Tokyo Electron Limited
- Substrate processing device, substrate processing method, and substrate processing system6 Jun 2017US 9,673,072 B2SCREEN Holdings Co., Ltd.
- Scheduling device and method therefor23 Jun 2015US 9,063,527 B2Kabushiki Kaisha Toshiba
- Evaluation system of the processing times in the manufacturing sector13 Jun 2024US 2024/0193496 A1Progress Lab S.R.L.
- Lamination planning method for laminate molded object, and laminate molded object manufacturing method and manufacturing device25 Aug 2022US 2022/0269242 A1Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Method, device, and non-transitory computer readable medium for determining timing of removing substrate from cassette in substrate processing device, and substrate processing device5 May 2022US 2022/0139741 A1Ebara Corporation
- Substrate processing device, substrate processing method, and substrate processing system30 Jun 2016US 2016/0189991 A1SCREEN Holdings Co., Ltd.
- Processing instructing device, processing instructing method, computer program and processing device4 Dec 2014US 2014/0358271 A1Tokyo Electron Limited
Most cited
By later US patents
- Adjusting a sampling rate based on state estimation results38US 6,766,214 B1Advanced Micro Devices, Inc. · 2004
- Work supplying method and apparatus to batch process apparatus for semiconductor wafer with preferential treatment to time critical lots12US 5,930,137 ANEC Corporation · 1999
- Working process end point real time determination method11US 6,490,497 B1NEC Corporation · 2002
- Processing instructing device, processing instructing method, computer program and processing device1US 9,696,711 B2Tokyo Electron Limited · 2017