G05B 2219/25242
Relay
G05B2219/25242 (Relay) appears on 11 US grants and 5 published applications in this corpus.
Search patents in G05B- Granted patents
- 11
- Published applications
- 5
- Assignees
- 8
- Inventors
- 21
- Latest grant
- 29 Mar 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 1 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Substrate processing capable of suppressing a decrease in throughput while reducing the impact on exposure treatment caused by warping of a substrate29 Mar 2022US 11,287,798 B2Tokyo Electron Limited
- Relay device for relaying data between devices, control method therefor, and non-transitory computer-readable recording medium therefor20 Jul 2021US 11,067,969 B2OMRON Corporation
- Substrate processing apparatus, substrate processing method and memory medium7 Jan 2020US 10,528,028 B2Tokyo Electron Limited
- Substrate processing apparatus, substrate processing method and memory medium21 Mar 2017US 9,601,394 B2Tokyo Electron Limited
- Fieldbus relay arrangement and method for implementing such arrangement25 Apr 2006US 7,035,693 B2Smar Research Corporation
- Substrate processing apparatus, substrate processing method and memory medium26 Mar 2020US 2020/0096966 A1Tokyo Electron Limited
- Relay device, control method for relay device, and non-transitory computer-readable recording medium12 Jul 2018US 2018/0196410 A1OMRON Corporation
- Substrate processing apparatus, substrate processing method and memory medium18 May 2017US 2017/0139399 A1Tokyo Electron Limited
- Substrate processing apparatus, substrate processing method and memory medium10 Sep 2015US 2015/0255355 A1Tokyo Electron Limited
- Fieldbus relay arrangement and method for implementing such arrangement29 Jul 2004US 2004/0148041 A1Smar Research Corporation
Most cited
By later US patents
- Fieldbus relay arrangement and method for implementing such arrangement47US 7,035,693 B2Smar Research Corporation · 2006
- System and method for providing integrated reclosing of circuit breakers in a power substation21US 5,896,302 ACommonwealth Edison Company · 1999
- System and method for providing backup protection for circuit breaker failure18US 6,058,353 ACommonwealth Edison Company · 2000
- System and method for the verification of a digital control system11US 5,719,559 ALimitorque Corporation · 1998
- Control system for transfer apparatus8US 4,697,448 AThe Budd Company · 1987