Substrate processing capable of suppressing a decrease in throughput while reducing the impact on exposure treatment caused by warping of a substrate

A method of processing a substrate, comprising:

• forming a photosensitive film on a front surface of a substrate comprising a wafer;
• after the photosensitive film is formed on the front surface of the substrate, acquiring measured warping data before the photosensitive film on the substrate undergoes exposure process;
• and
• before the photosensitive film on the substrate undergoes the exposure process, applying roughening process on a back surface of the substrate based on the measured warping data.

A non-transitory computer readable medium including a program, which causes circuitry of a control device of a substrate processing apparatus to execute a method of processing a substrate, comprising:

• forming a photosensitive film on a front surface of a substrate comprising a wafer;
• after the photosensitive film is formed on the front surface of the substrate, acquiring measured warping data before the photosensitive film on the substrate undergoes exposure process;
• and
• before the photosensitive film on the substrate undergoes the exposure process, applying roughening process on a back surface of the substrate based on the measured warping data.