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AssigneeTokyo Electron Limited
InventorsTeruhiko KODAMA, Masashi ENOMOTO
Estimating the term…
A substrate processing apparatus includes a film-forming device that forms a photosensitive film on a front surface of a substrate, a warping data acquisition device that acquires measured warping data of the substrate, a roughening process device that applies roughening process on a back surface of the substrate, and a control device including circuitry that controls the warping data acquisition device such that after the photosensitive film is formed on the front surface of the substrate, the warping data acquisition device acquires the measured warping data before the photosensitive film on the substrate undergoes exposure process, and control the roughening process device such that before the photosensitive film on the substrate undergoes the exposure process, the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data.
A substrate processing apparatus, comprising:
A method of processing a substrate, comprising:
A non-transitory computer readable medium including a program, which causes circuitry of a control device of a substrate processing apparatus to execute a method of processing a substrate, comprising:
Dependencies are inferred from the claim text.