Substrate processing apparatus, substrate processing method and memory medium

A substrate processing system, comprising:

• a film-forming device configured to form a photosensitive film on a front surface of a substrate;
• an exposure device configured to expose the photosensitive film formed on the substrate;
• a relay device positioned between the film-forming device and the exposure device and configured to transfer the substrate between the film-forming device and the exposure device;
• a warping data acquisition device configured to acquire measured warping data of the substrate;
• a roughening process device configured to apply roughening process on a back surface of the substrate;
• and
• a control device including a film-forming control sub-device, a relay control sub-device, a measuring control sub-device, and a process control sub-device,
• wherein the film-forming control sub-device is configured to control the film-forming device such that the film-forming device forms the photosensitive film on the front surface of the substrate, the relay control sub-device is configured to control the relay device such that the relay device transfers the substrate having the photosensitive film to the exposure device, the measuring control sub-device is configured to control the warping data acquisition device such that the warping data acquisition device acquires the measured warping data after controlling by the film-forming control sub-device prior to controlling by the relay control sub-device, and the process control sub-device is configured to control the roughening process device such that the roughening process device applies the roughening process on the back surface of the substrate based on the measured warping data after controlling by the measuring control sub-device prior to controlling by the relay control sub-device.