G02B 2006/12197
Grinding
Official title: {Grinding; Polishing}
G02B2006/12197 (Grinding) appears on 47 US grants and 57 published applications in this corpus.
Search patents in G02B- Granted patents
- 47
- Published applications
- 57
- Assignees
- 33
- Inventors
- 140
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 5 |
| 2004 | 4 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 2 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 3 | 3 |
| 2017 | 4 | 2 |
| 2018 | 2 | 4 |
| 2019 | 4 | 2 |
| 2020 | 2 | 4 |
| 2021 | 5 | 3 |
| 2022 | 2 | 4 |
| 2023 | 4 | 6 |
| 2024 | 3 | 5 |
| 2025 | 7 | 7 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a photonic chip7 Apr 2026US 12,596,230 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method and system for variable optical thickness waveguides for augmented reality devices26 Aug 2025US 12,399,320 B2Magic Leap, Inc.
- Method for integration of electro-optical materials in a photonic integrated circuit19 Aug 2025US 12,392,962 B2Cisco Technology, Inc.
- Structures for integrated silicon photonics optical gyroscopes19 Aug 2025US 12,392,963 B2Anello Photonics, Inc.
- Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate15 Jul 2025US 12,360,314 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Photonic integrated circuit and method of manufacturing a photonic integrated circuit17 Sep 2026US 2026/0276890 A1ams-OSRAM International GmbH
- Device and method for hybrid bonding in photonic integrated circuits30 Apr 2026US 2026/0118582 A1Mixx Technologies, Inc.
- Biased total thickness variations in waveguide display substrates2 Apr 2026US 2026/0093069 A1Magic Leap, Inc.
- Preparation method of multi-layer stacked waveguide5 Feb 2026US 2026/0036747 A1Foci Fiber Optic Communications, Inc.
- Photonic semiconductor-on-insulator (soi) substrate and method for forming the photonic soi substrate2 Oct 2025US 2025/0306270 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Ultra-high multiplex analytical systems and methods66US 8,247,216 B2Pacific Biosciences of California, Inc. · 2012
- Single-layer and multi-layer structures for integrated silicon photonics optical gyroscopes18US 10,969,548 B2Anello Photonics, Inc. · 2021
- Suspended photonic waveguides with top side sealing14US 10,416,380 B1Acacia Communications, Inc. · 2019
- High multiplex arrays and systems14US 8,993,307 B2Pacific Biosciences of California, Inc. · 2015
- Duplex optical connector plug and polarity reversal method of duplex optical connector plug13US 10,042,129 B2Seikoh Giken Co., Ltd. · 2018