Method for integration of electro-optical materials in a photonic integrated circuit

Abstract

A method includes providing a sacrificial wafer, contacting the sacrificial wafer to a photonic device wafer, and bonding the sacrificial wafer to the photonic device wafer. The sacrificial wafer includes a substrate and an electro-optical material strip disposed within a dielectric matrix. The photonic device wafer includes a photonic device die, and the electro-optical material strip is disposed proximate to the photonic device die. A photonic device structure includes a photonic device wafer and a sacrificial wafer. The photonic device structure includes a device wafer substrate and a photonic device die fabricated in a device wafer dielectric layer. The sacrificial wafer includes a sacrificial wafer substrate and an electro-optical material strip embedded in a sacrificial wafer dielectric matrix. The sacrificial wafer dielectric matrix is bonded to the device wafer dielectric layer, and the electro-optical material strip is disposed proximate to the photonic device die.

Dependencies are inferred from the claim text.