G01K 7/186
Using microstructures
Official title: {using microstructures}
G01K7/186 (Using microstructures) appears on 65 US grants and 73 published applications in this corpus.
Search patents in G01K- Granted patents
- 65
- Published applications
- 73
- Assignees
- 60
- Inventors
- 202
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 4 |
| 2008 | 2 | 6 |
| 2009 | 4 | 1 |
| 2010 | 4 | 2 |
| 2011 | 2 | 5 |
| 2012 | 2 | 0 |
| 2013 | 1 | 2 |
| 2014 | 3 | 3 |
| 2015 | 3 | 3 |
| 2016 | 1 | 1 |
| 2017 | 7 | 4 |
| 2018 | 2 | 3 |
| 2019 | 3 | 8 |
| 2020 | 6 | 4 |
| 2021 | 2 | 2 |
| 2022 | 4 | 4 |
| 2023 | 3 | 6 |
| 2024 | 3 | 4 |
| 2025 | 3 | 7 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor power devices having doped and silicided polysilicon temperature sensors therein5 May 2026US 12,622,045 B2North Carolina State University
- Semiconductor device and method of determining temperature of semiconductor device24 Mar 2026US 12,584,801 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Temperature-sensor assembly and method for producing a temperature sensor assembly24 Feb 2026US 12,560,492 B2Yageo Nexensos GmbH
- Electroconductive film and temperature sensor film3 Jun 2025US 12,320,715 B2Nitto Denko Corporation
- Display device11 Mar 2025US 12,248,221 B2Japan Display Inc.
- Device and method for sensing temperature based on resistor-capacitor digital-to-analog-converter16 Jul 2026US 2026/0202260 A1Samsung Electronics Co., Ltd.
- Anisotropic conductive adhesive compounds for an rtd27 Nov 2025US 2025/0364163 A1Yageo Nexensos GmbH
- Semiconductor device and electronic system including the semiconductor device11 Sep 2025US 2025/0283764 A1Samsung Electronics Co., Ltd.
- Linear temperature sensor with reduced number of terminals in hemt technology31 Jul 2025US 2025/0246497 A1STMicroelectronics International N. V.
- Coulomb blockade thermometer15 May 2025US 2025/0155295 A1Teknologian tutkimuskeskus VTT Oy
Most cited
By later US patents
- Thermal conductivity measurement apparatus and related methods36US 9,696,270 B1The United States of America as represented by the Secretary of the Air Force · 2017
- Sensor chip and apparatus for tactile and/or flow sensing34US 7,357,035 B2The Board of Trustees of the University of Illinois · 2008
- Circuitry and techniques for resistor-based temperature sensing17US 9,182,295 B1SiTime Corporation · 2015
- Microfabricated pressure and shear stress sensors16US 7,509,869 B2The Board of Trustees of the University of Illinois · 2009
- Platform unit for combined sensing of pressure, temperature and humidity14US 9,625,341 B2Technion Research & Development Foundation Limited · 2017