G01K 7/028
Using microstructures
Official title: {using microstructures, e.g. made of silicon}
G01K7/028 (Using microstructures) appears on 112 US grants and 117 published applications in this corpus.
Search patents in G01K- Granted patents
- 112
- Published applications
- 117
- Assignees
- 88
- Inventors
- 248
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 3 |
| 2003 | 3 | 5 |
| 2004 | 3 | 5 |
| 2005 | 4 | 6 |
| 2006 | 3 | 2 |
| 2007 | 4 | 4 |
| 2008 | 1 | 4 |
| 2009 | 3 | 3 |
| 2010 | 3 | 3 |
| 2011 | 2 | 7 |
| 2012 | 2 | 3 |
| 2013 | 4 | 1 |
| 2014 | 3 | 10 |
| 2015 | 2 | 1 |
| 2016 | 7 | 2 |
| 2017 | 4 | 8 |
| 2018 | 5 | 7 |
| 2019 | 5 | 0 |
| 2020 | 7 | 4 |
| 2021 | 1 | 3 |
| 2022 | 3 | 5 |
| 2023 | 4 | 7 |
| 2024 | 6 | 8 |
| 2025 | 14 | 11 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Sensing assembly11 Aug 2026US 12,704,418 B2Analog Devices International Unlimited Company
- Optically bridged multicomponent package with extended temperature range4 Aug 2026US 12,699,240 B2Sicily Merger Sub II, Inc.
- Optically bridged multicomponent package with extended temperature range7 Jul 2026US 12,674,948 B2Sicily Merger Sub II, Inc.
- Optically bridged multicomponent package with extended temperature range7 Jul 2026US 12,674,949 B2Sicily Merger Sub II, Inc.
- Methods for transferring graphene to substrates and related lithographic stacks and laminates24 Mar 2026US 12,588,432 B2Bard Access Systems, Inc.
- Systems and methods for wafer temperature measurement10 Sep 2026US 2026/0271658 A1Lam Research Corporation
- Curved conformal wireless passive heat flux sensor and preparation method thereof20 Aug 2026US 2026/0243609 A1North University of China
- Thin film-based sensor array20 Aug 2026US 2026/0247907 A1APPLIED Materials.Inc.
- Methods for Transferring Graphene to Substrates and Related Lithographic Stacks and Laminates6 Aug 2026US 2026/0231697 A1Bard Access Systems, Inc.
- Optically Bridged Multicomponent Package with Extended Temperature Range16 Jul 2026US 2026/0202634 A1Sicily Merger Sub II, Inc.
Most cited
By later US patents
- Dual wafer attachment process66US 6,287,940 B1Honeywell International Inc. · 2001
- Apparatus and method of detecting wear in an abradable coating system35US 7,618,712 B2Siemens Energy, Inc. · 2009
- Use of focused ion and electron beams for fabricating a sensor on a probe tip used for scanning multiprobe microscopy and the like33US 5,838,005 AThe Regents of the University of California · 1998
- Device and a method for thermal sensing32US 6,380,605 B1Imec Vzw · 2002
- Thermoelectric microprobe31US 5,969,238 AMax-Planck-Gesellschraft Zur foerderung der Wissenschaften E.V. · 1999