Optically Bridged Multicomponent Package with Extended Temperature Range

A method comprising:

• generating, by a light engine, a continuous-wave optical signal using at least one laser;
• coupling the continuous-wave optical signal from the at least one laser into an optical multi-die interconnect bridge (OMIB) disposed in a package, the OMIB having first and second interconnect regions for electrical interconnection to one or more dies;
• guiding the continuous-wave optical signal within the OMIB along at least one photonic path extending between the first interconnect region and the second interconnect region;
• operating a photonic transceiver having a first portion disposed in the OMIB and a second portion disposed in an electric integrated circuit (EIC) electrically connected to one of the first and second interconnect regions;
• wherein the first portion of the photonic transceiver resides in a photonic integrated circuit (PIC) and the second portion of the photonic transceiver resides in the EIC, and the first and the second portions are coupled via an electrical interconnect;
• modulating, by a modulator in the first portion of the photonic transceiver, the continuous-wave optical signal to generate a first optical signal on the at least one photonic path or detecting, by a photodetector in the first portion of the photonic transceiver, a second optical signal received on the at least one photonic path;
• and serializing, by a serializer in the second portion of the photonic transceiver, electrical data provided to the modulator or deserializing, by a deserializer in the second portion of the photonic transceiver, an electrical signal generated by the photodetector.