Systems and methods for wafer temperature measurement

An apparatus for semiconductor processing, the apparatus comprising:

• an airlock;
• and
• a temperature probe, wherein:
• the temperature probe is integrated into a wafer support located within the airlock,
• the wafer support is configured to support a wafer, and
• the temperature probe is configured to provide an absolute temperature of the wafer.

A method of determining wafer temperatures, the method comprising:

• determining an environmental temperature of an airlock using a first thermocouple disposed in a wafer support during an idle state of the airlock;
• obtaining temperature readings from the first thermocouple and a second thermocouple, wherein the second thermocouple is configured to measure a wafer temperature of a wafer proximate to a conductive pad operatively connected to the second thermocouple;
• and
• determining an absolute temperature of the wafer based at least in part on a combination of the environmental temperature of the airlock, the temperature readings from the first thermocouple, and the temperature readings from the second thermocouple.