G01J 2005/204
Prepared by semiconductor processing
Official title: {prepared by semiconductor processing, e.g. VLSI}
G01J2005/204 (Prepared by semiconductor processing) appears on 41 US grants and 50 published applications in this corpus.
Search patents in G01J- Granted patents
- 41
- Published applications
- 50
- Assignees
- 49
- Inventors
- 142
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 2 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 1 | 0 |
| 2014 | 1 | 4 |
| 2015 | 1 | 6 |
| 2016 | 6 | 2 |
| 2017 | 2 | 3 |
| 2018 | 2 | 1 |
| 2019 | 2 | 6 |
| 2020 | 1 | 3 |
| 2021 | 7 | 5 |
| 2022 | 0 | 3 |
| 2023 | 2 | 2 |
| 2024 | 4 | 6 |
| 2025 | 4 | 2 |
| 2026 | 4 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite material, bolometer, and composite material forming method8 Sep 2026US 12,730,009 B2NEC Corporation
- Microbolometer detectors with optical absorber structures for detection of terahertz radiation14 Jul 2026US 12,680,881 B2Technologies Luqia
- Systems and methods for monitoring the surface temperature of an object using an imager and the temperature-dependent absorption properties of semiconductors19 May 2026US 12,631,495 B2California Institute of Technology
- Thermal image sensor and method of manufacturing the same5 May 2026US 12,618,716 B2Samsung Electronics Co., Ltd.
- Spectrophotometer comprising phononic MEMS structure for sensing absorptive fluid28 Oct 2025US 12,455,190 B2
- Thermal detector of electromagnetic radiation comprising a thermometer diode6 Aug 2026US 2026/0227241 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Infrared bolometer using semiconducting carbon nanotubes and method for manufacturing the same15 Jan 2026US 2026/0016343 A1NEC Corporation
- Thermal image sensor and method of manufacturing the same3 Jul 2025US 2025/0216266 A1Samsung Electronics Co., Ltd.
- Methods and systems for fabrication of infrared transparent window wafer with integrated anti-reflection grating structures5 Jun 2025US 2025/0185393 A1DRS Network & Imaging Systems, LLC
- Composite material, bolometer, and composite material forming method12 Dec 2024US 2024/0410759 A1NEC Corporation
Most cited
By later US patents
- Semiconductor film bolometer thermal infrared detector58US 5,369,280 AThe Commonwealth of Australia · 1994
- Visible and infrared dual mode imaging system23US 8,408,821 B2OmniVision Technologies, Inc. · 2013
- Infrared camera architecture systems and methods14US 8,743,207 B2FLIR Systems, Inc. · 2014
- Two stage transformer coupling for ultra-sensitive silicon sensor pixel10US 7,375,333 B1Northrop Grumman Corporation · 2008
- Microbolometer array with improved performance9US 9,417,134 B2Centre Nationale de la Recherche Scientifique (CNRS) · 2016