F28D 15/043
Forming loops
Official title: {forming loops, e.g. capillary pumped loops}
F28D15/043 (Forming loops) appears on 363 US grants and 452 published applications in this corpus.
Search patents in F28D- Granted patents
- 363
- Published applications
- 452
- Assignees
- 218
- Inventors
- 780
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 8 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 1 |
| 2002 | 7 | 8 |
| 2003 | 12 | 17 |
| 2004 | 5 | 13 |
| 2005 | 12 | 24 |
| 2006 | 15 | 6 |
| 2007 | 3 | 15 |
| 2008 | 5 | 13 |
| 2009 | 3 | 8 |
| 2010 | 13 | 14 |
| 2011 | 12 | 13 |
| 2012 | 4 | 12 |
| 2013 | 5 | 13 |
| 2014 | 10 | 6 |
| 2015 | 9 | 17 |
| 2016 | 9 | 17 |
| 2017 | 10 | 13 |
| 2018 | 13 | 25 |
| 2019 | 27 | 47 |
| 2020 | 19 | 52 |
| 2021 | 37 | 32 |
| 2022 | 26 | 29 |
| 2023 | 20 | 17 |
| 2024 | 21 | 18 |
| 2025 | 16 | 9 |
| 2026 | 6 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Loop heat pipe with barrier body in condensation section21 Jul 2026US 12,687,345 B2ASUSTeK COMPUTER INC.
- Loop-type heat pipe10 Mar 2026US 12,571,598 B2Shinko Electric Industries Co., Ltd.
- Three-dimensional vapor chamber device3 Mar 2026US 12,566,033 B2Jws Technology Co., Ltd.
- Loop heat pipe for low voltage drives3 Mar 2026US 12,568,605 B2ABB Schweiz AG
- Loop heat pipe, housing assembly and electronic device24 Feb 2026US 12,563,700 B2Beijing Xiaomi Mobile Software Co., Ltd.
- Oscillating heat pipes operable within high gravity force equivalent (g-force) environments24 Sep 2026US 2026/0287272 A1Raytheon Company
- Heat pipe, electronic device, instrument, and method for manufacturing heat pipe13 Aug 2026US 2026/0239569 A1Sony Interactive Entertainment Inc.
- Redundantly pumped two-phase heat transfer loop6 Aug 2026US 2026/0227107 A1Calyos SA
- Three-dimensional loop type vapor chamber and heat dissipation device with the same30 Jul 2026US 2026/0218989 A1Delta Electronics, Inc.
- Heat exchanger, manufacturing method, and device9 Jul 2026US 2026/0197972 A1National University Corporation Tokai National Higher Education and Research System
Most cited
By later US patents
- Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator104US 6,533,029 B1Thermal Corp. · 2003
- Ceramic heat pipe wick89US 4,883,116 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 1989
- Capillary pumped loop body heat exchanger88US 5,725,049 AThe United States of America as represented by the Administrator of the National Aeronautics and Space Administration · 1998
- Evaporator and loop-type heat pipe using the same86US 6,330,907 B1Mitsubishi Denki Kabushiki Kaisha · 2001
- Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction80US 6,382,309 B1Swales Aerospace · 2002