Three-dimensional loop type vapor chamber and heat dissipation device with the same

A heat dissipation device, comprising:

• a three-dimensional loop type vapor chamber, comprising:
• a plate vapor chamber, comprising an upper casing, a lower casing, and a capillary structure, wherein the capillary structure is disposed between the upper casing and the lower casing, and a heat absorption area and a heat dissipation area are formed within the plate vapor chamber, and the capillary structure comprises a capillary structure cavity located in the heat absorption area;
• the upper casing in the heat absorption area comprises a plurality of first openings, and the upper casing in the heat dissipation area comprises a plurality of second openings;
• and
• a plurality of U-shaped heat pipes, wherein each of the U-shaped heat pipes comprises an inlet end and an outlet end respectively fixed to a corresponding first opening and a corresponding second opening of the upper casing of the plate vapor chamber, wherein the inlet ends of the U-shaped heat pipes are connected to the first openings and communicate with the capillary structure cavity;
• and
• a plurality of heat dissipation fins formed with a plurality of heat dissipation fin openings, wherein the U-shaped heat pipes are disposed within the heat dissipation fin openings.

A heat dissipation device, comprising:

• a three-dimensional loop type vapor chamber, comprising:
• a plate vapor chamber, comprising an upper casing, a lower casing, and a capillary structure, wherein the capillary structure is disposed between the upper casing and the lower casing, and a heat absorption area and a heat dissipation area are formed within the plate vapor chamber, and the capillary structure comprises a capillary structure cavity located in the heat absorption area;
• the upper casing in the heat absorption area comprises a plurality of first openings, and the upper casing in the heat dissipation area comprises a plurality of second openings;
• and
• a plurality of U-shaped heat pipes, wherein each of the U-shaped heat pipes comprises an inlet end and an outlet end respectively fixed to a corresponding first opening and a corresponding second opening of the upper casing of the plate vapor chamber, wherein the inlet ends of the U-shaped heat pipes are connected to the first openings and communicate with the capillary structure cavity;
• a plurality of heat dissipation fins formed with a plurality of heat dissipation fin openings, wherein the U-shaped heat pipes are disposed within the heat dissipation fin openings;
• and
• a housing formed with an air inlet and an air outlet to guide a heat dissipation airflow, wherein the heat dissipation fins are disposed in the housing.