Loop heat pipe with barrier body in condensation section
AssigneeASUSTeK COMPUTER INC.
InventorIng-Jer Chiou
Life of this patent
Estimating the term…
Loading patent…
AssigneeASUSTeK COMPUTER INC.
InventorIng-Jer Chiou
Estimating the term…
A loop type heat dissipation structure includes a heat pipe, a communicating pipe, and working fluid. The heat pipe includes a pipeline, a capillary structure, and a first barrier body. The pipeline has a first evaporation section, a first condensation section, an outlet, and an inlet. The outlet is located at an edge of the first evaporation section, and the inlet is located at an edge of the first condensation section. The capillary structure is distributed on an inner wall surface of the pipeline and extends from the first condensation section to the first evaporation section. The first barrier body is disposed in the first condensation section and is connected to the capillary structure. One end of the communicating pipe is communicated with the outlet, and the other end of the communicating pipe is communicated with the inlet. The working fluid flows in the heat pipe and the communicating pipe.
A loop type heat dissipation structure, comprising:
Dependencies are inferred from the claim text.