Loop heat pipe, housing assembly and electronic device

A housing assembly, comprising:

• a housing;
• and
• a loop heat pipe provided in the housing, wherein the loop heat pipe comprises:
• a housing component, provided with a pipeline unit, a first partition part and at least two evaporation cavities, wherein the pipeline unit is provided with a liquid replenishment passage, the at least two evaporation cavities are spaced apart in a length direction of the liquid replenishment passage, two adjacent evaporation cavities of the at least two evaporation cavities are separated by the first partition part, and each of the evaporation cavities comprises a vapor outlet communicated with one end of the pipeline unit and a liquid replenishment port communicated with the liquid replenishment passage;
• a first capillary structure, wherein at least part of the first capillary structure is disposed in the liquid replenishment passage and the at least two evaporation cavities;
• and
• a second capillary structure, disposed in at least one of the liquid replenishment passage and the evaporation cavities, wherein the second capillary structure comprises first bodies that correspond to the evaporation cavities on a one-to-one basis, each of the first bodies blocks the liquid replenishment port of the corresponding evaporation cavity, and at least part of each of the first bodies is in contact with the first capillary structure.

An electronic device, comprising:

• heat sources;
• and
• a loop heat pipe, comprising:
• a housing component, provided with a pipeline unit, a first partition part and at least two evaporation cavities, wherein the pipeline unit is provided with a liquid replenishment passage, the at least two evaporation cavities are spaced apart in a length direction of the liquid replenishment passage, two adjacent evaporation cavities of the at least two evaporation cavities are separated by the first partition part, and at least one of the evaporation cavities comprises a vapor outlet communicated with one end of the pipeline unit and a liquid replenishment port communicated with the liquid replenishment passage;
• a first capillary structure, wherein at least part of the first capillary structure is disposed in the liquid replenishment passage and the at least two evaporation cavities;
• and
• a second capillary structure, disposed in at least one of the liquid replenishment passage and the evaporation cavities, wherein the second capillary structure comprises first bodies that correspond to the evaporation cavities on a one-to-one basis, at least one of the first bodies blocks the liquid replenishment port of the corresponding evaporation cavity, and at least part of the at least one of the first bodies is in contact with the first capillary structure,
• wherein the heat sources comprise at least two heat sources corresponding to the evaporation cavities on a one-to-one basis, the heat sources and the housing component cooperate in heat conduction, and at least part of the heat sources overlaps with the corresponding evaporation cavities on a orthogonal projection surface in a thickness direction of the loop heat pipe.