F28D 15/0266
With separate evaporating and condensing chambers connected by at least one conduit
Official title: {with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence)}
F28D15/0266 (With separate evaporating and condensing chambers connected by at least one conduit) appears on 1,464 US grants and 1,913 published applications in this corpus.
Search patents in F28D- Granted patents
- 1,464
- Published applications
- 1,913
- Assignees
- 708
- Inventors
- 3,265
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 7 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 5 | 0 |
| 1981 | 7 | 0 |
| 1982 | 7 | 0 |
| 1983 | 4 | 0 |
| 1984 | 8 | 0 |
| 1985 | 6 | 0 |
| 1986 | 11 | 0 |
| 1987 | 11 | 0 |
| 1988 | 10 | 0 |
| 1989 | 8 | 0 |
| 1990 | 10 | 0 |
| 1991 | 6 | 0 |
| 1992 | 8 | 0 |
| 1993 | 10 | 0 |
| 1994 | 8 | 0 |
| 1995 | 11 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 16 | 0 |
| 1999 | 21 | 0 |
| 2000 | 23 | 0 |
| 2001 | 15 | 10 |
| 2002 | 24 | 22 |
| 2003 | 22 | 44 |
| 2004 | 44 | 59 |
| 2005 | 36 | 74 |
| 2006 | 46 | 72 |
| 2007 | 33 | 116 |
| 2008 | 35 | 96 |
| 2009 | 34 | 86 |
| 2010 | 65 | 90 |
| 2011 | 54 | 79 |
| 2012 | 34 | 89 |
| 2013 | 35 | 75 |
| 2014 | 42 | 73 |
| 2015 | 47 | 69 |
| 2016 | 50 | 87 |
| 2017 | 46 | 85 |
| 2018 | 61 | 72 |
| 2019 | 94 | 111 |
| 2020 | 79 | 103 |
| 2021 | 78 | 83 |
| 2022 | 64 | 76 |
| 2023 | 53 | 57 |
| 2024 | 59 | 65 |
| 2025 | 55 | 63 |
| 2026 | 30 | 57 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Loop heat pipe for staged reentry spacecraft29 Sep 2026US 12,747,038 B1The United States of America as represented by the Secretary of the Air Force
- Heat pipe with brazed seam1 Sep 2026US 12,723,822 B2Aavid Thermal Corp.
- Combination heat dissipation unit1 Sep 2026US 12,727,120 B2Asia Vital Components (China) Co., Ltd.
- Vapor chamber25 Aug 2026US 12,716,658 B2Purple Cloud Development Pte. Ltd.
- Integrated preheated pump-driven two-phase flow system11 Aug 2026US 12,707,596 B2Apaltek Co., Ltd.
- Oscillating heat pipe with phase change material1 Oct 2026US 2026/0298548 A1Raytheon Company
- Heat pipe apparatuses17 Sep 2026US 2026/0276314 A1Wisconsin Alumni Research Foundation
- Penetration-free heat transfer system17 Sep 2026US 2026/0276315 A1Government of the United States as Represented by the Secretary of the Air Force
- Triple-pipe-heat pipe millimeter channel reactor and use method thereof3 Sep 2026US 2026/0259012 A1Shihezi University
- Thin vapor chamber27 Aug 2026US 2026/0251400 A1Nidec Chaun-Choung Technology Corporation
Most cited
By later US patents
- Computing infrastructure672US 8,706,914 B22014
- Structure of a heat pipe237US 4,921,041 AActronics Kabushiki Kaisha · 1990
- Electronic enclosure cooling system178US 6,462,949 B1ThermoTek, Inc. · 2002
- Heat management system167US 6,351,381 B1Thermal Corp. · 2002
- Two-phase cooling system for laptop computers153US 5,383,340 AAavid Laboratories, Inc. · 1995