Vapor chamber
AssigneePurple Cloud Development Pte. Ltd.
InventorsXue Mei Wang, Xiao Min Zhang, Xiong Zhang
Life of this patent
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Abstract
A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.
Claims11
A vapor chamber, comprising:
- a first cover, having a thermal contact surface configured to be thermally coupled to a heat source;
- and
- a second cover, wherein the second cover and the first cover are joined together to form an air tight space, the air tight space is configured to accommodate a cooling fluid, and the thermal contact surface faces away from the air tight space;
- wherein the second cover has a first surface, a second surface and a plurality of pressed first support protrusion structures extending from the second surface, the first surface faces away from the first cover, the second surface faces the first cover, the pressed first support protrusion structures extend outwardly from the second surface of the second cover towards the heat source that is thermally coupled to the thermal contact surface, the pressed first support protrusion structures are arranged within an outer contour of a thermally conductive protrusion structure of the first cover, and a first subset of the pressed first support protrusion structures disposed along a first boundary side of the outer contour are spaced from one another with substantially equal distances, while a second subset of the pressed first support protrusion structures disposed along a second boundary side of the outer contour opposite the first boundary side are spaced from one another with unequal distances.
A vapor chamber, comprising:
- a first cover, having a thermally conductive protrusion structure configured to be thermally coupled to a heat source;
- and
- a second cover, wherein the second cover and the first cover are joined together to form an air tight space, and the air tight space is configured to accommodate a cooling fluid;
- wherein the second cover has a plurality of pressed first support protrusion structures extending from the second cover, the first support protrusion structures and the thermally conductive protrusion structure protrude in a same direction, the pressed first support protrusion structures extend outwardly from the second cover towards the heat source that is thermally coupled to the thermally conductive protrusion structure, the pressed first support protrusion structures are arranged within an outer contour of the thermally conductive protrusion structure, and a first subset of the pressed first support protrusion structures disposed along a first boundary side of the outer contour are spaced from one another with substantially equal distances, while a second subset of the pressed first support protrusion structures disposed along a second boundary side of the outer contour opposite the first boundary side are spaced from one another with unequal distances.
Dependencies are inferred from the claim text.