C25D 3/60
Containing more than 50% by weight of tin
Official title: containing more than 50% by weight of tin
C25D3/60 (Containing more than 50% by weight of tin) appears on 319 US grants and 282 published applications in this corpus.
Search patents in C25D- Granted patents
- 319
- Published applications
- 282
- Assignees
- 187
- Inventors
- 725
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 6 | 0 |
| 1978 | 1 | 0 |
| 1979 | 6 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 9 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 1 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 8 | 0 |
| 2002 | 12 | 13 |
| 2003 | 7 | 13 |
| 2004 | 10 | 12 |
| 2005 | 3 | 9 |
| 2006 | 5 | 14 |
| 2007 | 6 | 7 |
| 2008 | 3 | 6 |
| 2009 | 3 | 3 |
| 2010 | 5 | 8 |
| 2011 | 5 | 5 |
| 2012 | 1 | 8 |
| 2013 | 7 | 14 |
| 2014 | 4 | 14 |
| 2015 | 9 | 22 |
| 2016 | 21 | 21 |
| 2017 | 16 | 20 |
| 2018 | 12 | 16 |
| 2019 | 22 | 13 |
| 2020 | 11 | 18 |
| 2021 | 11 | 14 |
| 2022 | 11 | 7 |
| 2023 | 7 | 8 |
| 2024 | 10 | 10 |
| 2025 | 4 | 6 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Low alpha-ray emission stannous oxide and method of producing the same5 May 2026US 12,617,694 B2Mitsubishi Materials Corporation
- Electrodeposition of pure phase SnSb from eutectic ethaline solution for sodium-ion and lithium-ion battery anodes31 Mar 2026US 12,590,380 B2Colorado State University Research Foundation
- Composition for tin-silver alloy electroplating comprising a complexing agent24 Feb 2026US 12,559,852 B2BASF SE
- Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding20 Jan 2026US 12,529,159 B2Hong Kong Applied Science and Technology Research Institute Company Limited
- Composition for tin or tin alloy electroplating comprising leveling agent30 Dec 2025US 12,509,790 B2BASF SE
- Composition for tin or tin alloy electroplating comprising leveling agent1 Jan 2026US 2026/0002280 A1BASF SE
- Leveling agent, composition, and application thereof3 Jul 2025US 2025/0215598 A1Fudan University
- Tin alloy plating solution19 Jun 2025US 2025/0198038 A1Mitsubishi Materials Corporation
- Anolyte solution dosing for electroplating apparatus1 May 2025US 2025/0137163 A1Lam Research Corporation
- Dispersion electrolyte for graphite-containing layers27 Feb 2025US 2025/0066944 A1Dr.-Ing. Max Schlotter GmbH & Co. KG
Most cited
By later US patents
- Electrode structural body, rechargeable battery provided with said electrode structural body, and rechargeable battery206US 6,432,585 B1Canon Kabushiki Kaisha · 2002
- Tin, lead, and tin-lead alloy plating baths67US 4,459,185 AIshibara Chemical Co., Ltd. · 1984
- Electroplating baths, additives therefor and methods for the electrodeposition of metals65US 4,384,930 AMcGean-Rohco, Inc. · 1983
- Electrodeposited eutectic tin-bismuth alloy on a conductive substrate63US 5,039,576 AAtochem North America, Inc. · 1991
- Plating bath and method for electroplating tin and/or lead39US 4,582,576 AMcGean-Rohco, Inc. · 1986