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US 2025/0198038 A1Published application
Tin alloy plating solution
AssigneeMitsubishi Materials Corporation
InventorKoji Tatsumi
Life of this patent
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Abstract
A tin alloy plating solution of the present invention includes (A) a soluble salt or oxide including at least a stannous salt, (B) a soluble salt of a metal nobler than tin, (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms, (D) a free acid, and (E) an antioxidant. In addition, a content of the tin complexing agent is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) is 30 g/L or more.
Claims4
A method for producing a tin alloy comprising performing electroplating by using a tin alloy plating solution, wherein
- the tin alloy plating solution comprises:
- (A) a soluble salt or oxide including at least a stannous salt;
- (B) a soluble salt or oxide of a metal nobler than tin;
- (C) a tin complexing agent formed of a sugar alcohol having 4 or more and 6 or less carbon atoms;
- (D) a free acid;
- and
- (E) an antioxidant,
- a content of the tin complexing agent in the tin alloy plating solution is 0.1 g/L or more and 5 g/L or less, and a concentration of divalent tin ions (Sn2+) in the tin alloy plating solution is 30 g/L or more.
5 more elements
Dependencies are inferred from the claim text.