C25D 17/007
Current directing devices
Official title: {Current directing devices}
C25D17/007 (Current directing devices) appears on 200 US grants and 254 published applications in this corpus.
Search patents in C25D- Granted patents
- 200
- Published applications
- 254
- Assignees
- 106
- Inventors
- 486
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 3 | 3 |
| 2003 | 3 | 3 |
| 2004 | 2 | 6 |
| 2005 | 3 | 3 |
| 2006 | 0 | 7 |
| 2007 | 4 | 6 |
| 2008 | 1 | 12 |
| 2009 | 2 | 6 |
| 2010 | 8 | 6 |
| 2011 | 8 | 4 |
| 2012 | 12 | 13 |
| 2013 | 6 | 15 |
| 2014 | 6 | 9 |
| 2015 | 9 | 11 |
| 2016 | 9 | 21 |
| 2017 | 11 | 17 |
| 2018 | 14 | 9 |
| 2019 | 15 | 14 |
| 2020 | 9 | 11 |
| 2021 | 9 | 13 |
| 2022 | 13 | 14 |
| 2023 | 18 | 17 |
| 2024 | 12 | 15 |
| 2025 | 7 | 11 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Plating apparatus and plating method28 Jul 2026US 12,692,617 B2Ebara Corporation
- Plating apparatus14 Jul 2026US 12,680,187 B2Ebara Corporation
- Semiconductor film plating perimeter mapping and compensation3 Mar 2026US 12,568,778 B2APPLIED Materials.Inc.
- Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate30 Sep 2025US 12,428,746 B2Semsysco GmbH
- Plating apparatus, plating method, and method for producing wire rod having the surface plated9 Sep 2025US 12,410,536 B2National Institutes for Quantum Science and Technology
- Substrate electroplating apparatus and method3 Sep 2026US 2026/0258575 A1ACM Research (Shanghai) Inc.
- Matrix-controlled printhead for an electrochemical additive manufacturing system16 Jul 2026US 2026/0201590 A1Fabric8Labs, Inc.
- Distribution system for the simultaneous chemical and/or electrolytic surface treatment of at least two substrates16 Jul 2026US 2026/0201598 A1Lam Research Salzburg GmbH
- Semiconductor film plating perimeter mapping and compensation9 Jul 2026US 2026/0198236 A1APPLIED Materials.Inc.
- Plating apparatus and plating method4 Jun 2026US 2026/0157208 A1Ebara Corporation
Most cited
By later US patents
- Plating cell with horizontal product load mechanism314US 5,932,077 AReynolds Tech Fabricators, Inc. · 1999
- Rotary electroplating cell with controlled current distribution234US 4,304,641 AInternational Business Machines Corporation · 1981
- Vertical paddle plating cell223US 5,516,412 AInternational Business Machines Corporation · 1996
- Method and apparatus for treating surface including virtual anode209US 6,179,983 B2Novellus Systems, Inc. · 2001
- Cathode current control system for a wafer electroplating apparatus81US 6,004,440 ASemitool, Inc. · 1999