C23F 1/20
For etching aluminium or alloys thereof
Official title: for etching aluminium or alloys thereof
C23F1/20 (For etching aluminium or alloys thereof) appears on 180 US grants and 223 published applications in this corpus.
Search patents in C23F- Granted patents
- 180
- Published applications
- 223
- Assignees
- 174
- Inventors
- 650
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 2 |
| 2002 | 5 | 3 |
| 2003 | 1 | 5 |
| 2004 | 2 | 6 |
| 2005 | 0 | 14 |
| 2006 | 10 | 12 |
| 2007 | 2 | 3 |
| 2008 | 3 | 2 |
| 2009 | 5 | 3 |
| 2010 | 3 | 3 |
| 2011 | 1 | 5 |
| 2012 | 2 | 4 |
| 2013 | 8 | 9 |
| 2014 | 2 | 4 |
| 2015 | 2 | 13 |
| 2016 | 6 | 14 |
| 2017 | 3 | 9 |
| 2018 | 10 | 11 |
| 2019 | 11 | 19 |
| 2020 | 9 | 14 |
| 2021 | 11 | 13 |
| 2022 | 7 | 12 |
| 2023 | 11 | 14 |
| 2024 | 9 | 12 |
| 2025 | 8 | 7 |
| 2026 | 7 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Continuous coil pretreatment process6 Oct 2026US 12,753,515 B2Arconic Technologies LLC
- Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same12 May 2026US 12,624,285 B2Samsung Electronics Co., Ltd.
- Surface treatment method of aluminum material21 Apr 2026US 12,606,926 B2Samsung Electronics Co., Ltd.
- Etchant composition7 Apr 2026US 12,595,568 B2Kao Corporation
- Etching composition, method of etching metal-containing film by using the same, and method of preparing semiconductor device by using the same31 Mar 2026US 12,590,247 B2Samsung Electronics Co., Ltd.
- Continuous coil pretreatment process8 Oct 2026US 2026/0308766 A1Arconic Technologies LLC
- Porous metal structures incorporating nanoparticles13 Aug 2026US 2026/0232876 A1Yissum Research Development Company of the Hebrew University of Jerusalem
- Etchant composition16 Jul 2026US 2026/0201569 A1Kao Corporation
- Automotive part identification marking system11 Jun 2026US 2026/0159707 A1CatMarks Manufacturing, LLC
- Single step surface preparation using a citric acid composition30 Apr 2026US 2026/0117391 A1Blue Origin Manufacturing, LLC
Most cited
By later US patents
- Method for forming solder bumps in semiconductor devices143US 5,508,229 ANational Semiconductor Corporation · 1996
- Generation of compact alumina passivation layers on aluminum plasma equipment components108US 9,903,020 B2APPLIED Materials.Inc. · 2018
- Conditioned semiconductor system parts107US 9,885,117 B2APPLIED Materials.Inc. · 2018
- Surface pretreatment of metals to activate the surface for sol-gel coating70US 5,869,140 AThe Boeing Company · 1999
- Sol-gel coated metal62US 5,939,197 AThe Boeing Company · 1999