C22C 9/06
Alloys based on copper: with nickel or cobalt as the next major
Official title: with nickel or cobalt as the next major constituent
C22C9/06 (Alloys based on copper: with nickel or cobalt as the next major) appears on 575 US grants and 700 published applications in this corpus.
Search patents in C22C- Granted patents
- 575
- Published applications
- 700
- Assignees
- 309
- Inventors
- 1,351
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 6 | 0 |
| 1984 | 6 | 0 |
| 1985 | 4 | 0 |
| 1986 | 10 | 0 |
| 1987 | 5 | 0 |
| 1988 | 10 | 0 |
| 1989 | 4 | 0 |
| 1990 | 5 | 0 |
| 1991 | 12 | 0 |
| 1992 | 4 | 0 |
| 1993 | 8 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 6 | 2 |
| 2002 | 5 | 11 |
| 2003 | 11 | 17 |
| 2004 | 6 | 15 |
| 2005 | 5 | 9 |
| 2006 | 4 | 13 |
| 2007 | 5 | 19 |
| 2008 | 5 | 22 |
| 2009 | 7 | 31 |
| 2010 | 12 | 32 |
| 2011 | 7 | 38 |
| 2012 | 15 | 21 |
| 2013 | 13 | 45 |
| 2014 | 13 | 38 |
| 2015 | 22 | 38 |
| 2016 | 33 | 35 |
| 2017 | 26 | 44 |
| 2018 | 33 | 39 |
| 2019 | 38 | 51 |
| 2020 | 44 | 38 |
| 2021 | 38 | 47 |
| 2022 | 25 | 20 |
| 2023 | 23 | 21 |
| 2024 | 20 | 26 |
| 2025 | 17 | 15 |
| 2026 | 12 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices25 Aug 2026US 12,721,208 B2Nippon Micrometal Corporation
- Sliding member, bearing, sliding member manufacturing method, and bearing manufacturing method9 Jun 2026US 12,650,146 B2Senju Metal Industry Co., Ltd.
- Binder compositions of tungsten tetraboride and abrasive methods thereof26 May 2026US 12,636,756 B2SuperMetalix, Inc.
- Electrically-conductive material having excellent wear resistance and heat resistance19 May 2026US 12,630,903 B2TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
- Copper-diamond composite, heat dissipation member, and electronic device28 Apr 2026US 12,612,682 B2Denka Company Limited
- Copper alloy powder for additive manufacturing, copper alloy additively manufactured product, and manufacturing method of copper alloy additively manufactured product3 Sep 2026US 2026/0258527 A1Fukuda Metal Foil & Powder Co., Ltd.
- Methods for manufacturing additive manufacturing components27 Aug 2026US 2026/0249350 A1Valls Besitz GmbH
- Copper alloy sheet27 Aug 2026US 2026/0250802 A1Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)
- Laminate and method for manufacturing circuit board27 Aug 2026US 2026/0255493 A1Arisawa Mfg.Co., Ltd.
- Pulse magnetic field treatment method for eliminating residual stress in copper alloy foils20 Aug 2026US 2026/0242917 A1Taiyuan University of Technology
Most cited
By later US patents
- Welding electrode73US 4,010,309 AThe International Nickel Company, Inc. · 1977
- Tin coated electrical connector46US 5,916,695 AOlin Corporation · 1999
- Multipurpose copper alloys with moderate conductivity and high strength39US 4,594,221 AOlin Corporation · 1986
- Multi-component solid solution alloys having high mixing entropy39US 9,150,945 B2UT-Battelle, LLC · 2015
- Raw material powder for laser clad valve seat and valve seat using the same35US 7,757,396 B2Honda Motor Co., Ltd. · 2010