C09J 2301/12
By the arrangement of layers
Official title: by the arrangement of layers
C09J2301/12 (By the arrangement of layers) appears on 1,172 US grants and 2,060 published applications in this corpus.
Search patents in C09J- Granted patents
- 1,172
- Published applications
- 2,060
- Assignees
- 625
- Inventors
- 3,909
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 10 | 0 |
| 1998 | 13 | 0 |
| 1999 | 21 | 0 |
| 2000 | 27 | 0 |
| 2001 | 24 | 19 |
| 2002 | 26 | 22 |
| 2003 | 24 | 28 |
| 2004 | 14 | 27 |
| 2005 | 16 | 19 |
| 2006 | 9 | 22 |
| 2007 | 7 | 25 |
| 2008 | 5 | 32 |
| 2009 | 10 | 49 |
| 2010 | 11 | 40 |
| 2011 | 9 | 35 |
| 2012 | 15 | 42 |
| 2013 | 13 | 68 |
| 2014 | 21 | 91 |
| 2015 | 23 | 118 |
| 2016 | 28 | 111 |
| 2017 | 52 | 95 |
| 2018 | 63 | 98 |
| 2019 | 77 | 120 |
| 2020 | 89 | 134 |
| 2021 | 81 | 194 |
| 2022 | 82 | 174 |
| 2023 | 74 | 141 |
| 2024 | 104 | 139 |
| 2025 | 110 | 133 |
| 2026 | 77 | 84 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrically peelable adhesive composition, electrically peelable adhesive product, and utilization thereof6 Oct 2026US 12,753,330 B2Vigteqnos Co., Ltd.
- Heat-activatable linerless label constructions29 Sep 2026US 12,747,373 B2Avery Dennison Corporation
- Electrical debonding adhesive sheet, joined body, and method for separating joined body29 Sep 2026US 12,747,375 B2Nitto Denko Corporation
- Mount tape having an inner support layer between adhesive layers for semiconductor device assembly22 Sep 2026US 12,745,601 B2Micron Technology, Inc.
- Adhesive label8 Sep 2026US 12,729,325 B2Upm Raflatac Oy
- Adhesive sheet8 Oct 2026US 2026/0308423 A1Samsung SDI.Co., Ltd.
- Hot-Melt, Pressure-Sensitive Adhesive With A Wide Range Of Application-Temperature8 Oct 2026US 2026/0308424 A1Henry Company, LLC
- Heat-activatable linerless label constructions1 Oct 2026US 2026/0297387 A1Avery Dennison Corporation
- Joint support including encapsulated adhesive1 Oct 2026US 2026/0297962 A1
- Secondary layer assembly for an impact surface and method thereof24 Sep 2026US 2026/0284492 A1Gear Ties LLC D/B/A Xtrudex
Most cited
By later US patents
- Removable adhesive tape with controlled sequential release419US 6,001,471 A3M Innovative Properties Company · 1999
- Adhesive tapes247US 5,277,972 ATomoegawa Paper Co., Ltd. · 1994
- Adhesive tapes220US 5,683,806 ATomoegawa Paper Co., Ltd. · 1997
- Magnetized hot melt adhesive articles135US 5,985,435 AL&L Products, Inc. · 1999
- Method for adhering substrates using adhesive devices containing silicone gels83US 6,846,508 B1Dow Corning France S. A. · 2005