C09J 2301/10
Characterized by the structural features of the adhesive tape or sheet
Official title: characterized by the structural features of the adhesive tape or sheet
C09J2301/10 (Characterized by the structural features of the adhesive tape or sheet) appears on 1,705 US grants and 2,865 published applications in this corpus.
Search patents in C09J- Granted patents
- 1,705
- Published applications
- 2,865
- Assignees
- 866
- Inventors
- 5,337
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 4 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 6 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 7 | 0 |
| 1986 | 8 | 0 |
| 1987 | 5 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 8 | 0 |
| 1991 | 5 | 0 |
| 1992 | 11 | 0 |
| 1993 | 11 | 0 |
| 1994 | 15 | 0 |
| 1995 | 8 | 0 |
| 1996 | 12 | 0 |
| 1997 | 18 | 0 |
| 1998 | 21 | 0 |
| 1999 | 35 | 0 |
| 2000 | 44 | 0 |
| 2001 | 40 | 22 |
| 2002 | 39 | 37 |
| 2003 | 48 | 65 |
| 2004 | 24 | 69 |
| 2005 | 29 | 41 |
| 2006 | 22 | 53 |
| 2007 | 12 | 56 |
| 2008 | 14 | 70 |
| 2009 | 12 | 84 |
| 2010 | 20 | 72 |
| 2011 | 19 | 70 |
| 2012 | 29 | 71 |
| 2013 | 23 | 91 |
| 2014 | 27 | 121 |
| 2015 | 36 | 143 |
| 2016 | 40 | 131 |
| 2017 | 71 | 122 |
| 2018 | 78 | 138 |
| 2019 | 98 | 140 |
| 2020 | 114 | 167 |
| 2021 | 92 | 241 |
| 2022 | 104 | 230 |
| 2023 | 88 | 171 |
| 2024 | 137 | 182 |
| 2025 | 149 | 167 |
| 2026 | 92 | 111 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrically peelable adhesive composition, electrically peelable adhesive product, and utilization thereof6 Oct 2026US 12,753,330 B2Vigteqnos Co., Ltd.
- Heat-activatable linerless label constructions29 Sep 2026US 12,747,373 B2Avery Dennison Corporation
- Electrical debonding adhesive sheet, joined body, and method for separating joined body29 Sep 2026US 12,747,375 B2Nitto Denko Corporation
- Mount tape having an inner support layer between adhesive layers for semiconductor device assembly22 Sep 2026US 12,745,601 B2Micron Technology, Inc.
- Pressure-sensitive adhesive composition for patterned pressure-sensitive adhesive tape, patterned pressure-sensitive adhesive tape, and production method thereof15 Sep 2026US 12,735,609 B2DIC Corporation
- Adhesive sheet8 Oct 2026US 2026/0308423 A1Samsung SDI.Co., Ltd.
- Hot-Melt, Pressure-Sensitive Adhesive With A Wide Range Of Application-Temperature8 Oct 2026US 2026/0308424 A1Henry Company, LLC
- Heat-activatable linerless label constructions1 Oct 2026US 2026/0297387 A1Avery Dennison Corporation
- Joint support including encapsulated adhesive1 Oct 2026US 2026/0297962 A1
- Secondary layer assembly for an impact surface and method thereof24 Sep 2026US 2026/0284492 A1Gear Ties LLC D/B/A Xtrudex
Most cited
By later US patents
- Removable adhesive tape with controlled sequential release419US 6,001,471 A3M Innovative Properties Company · 1999
- Adhesive tapes247US 5,277,972 ATomoegawa Paper Co., Ltd. · 1994
- In-mold label film and method245US 6,004,682 AAvery Dennison Corporation · 1999
- Adhesive tapes220US 5,683,806 ATomoegawa Paper Co., Ltd. · 1997
- Perforated roll of elastic wrap136US 5,616,387 AMinnesota Mining and Manufacturing Company · 1997