C09J 163/06
Triglycidylisocyanurates
C09J163/06 (Triglycidylisocyanurates) appears on 6 US grants and 7 published applications in this corpus.
Search patents in C09J- Granted patents
- 6
- Published applications
- 7
- Assignees
- 7
- Inventors
- 12
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 0 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device19 May 2026US 12,630,707 B2Nitto Denko Corporation
- Photosensitive adhesive composition24 Nov 2020US 10,844,255 B2Nissan Chemical Corporation
- Pressure sensitive adhesives based on renewable resources, UV curing and related methods27 Sep 2016US 9,453,151 B2Avery Dennison Corporation
- Adhesive compositions for use in die attach applications16 Sep 2014US 8,835,574 B2Henkel IP & Holding GmbH
- Adhesive compositions for use in die attach applications25 Dec 2012US 8,338,536 B2Henkel Corporation
- Resin composition for sealing optical semiconductor, resin molded product for sealing optical semiconductor, optical semiconductor sealing material, and optical semiconductor device9 Mar 2023US 2023/0071071 A1Nitto Denko Corporation
- Photosensitive adhesive composition11 Jul 2019US 2019/0211242 A1Nissan Chemical Corporation
- Pressure Sensitive Adhesives Based on Renewable Resources, UV Curing and Related Methods12 Jan 2017US 2017/0009104 A1Avery Dennison Corporation
- Adhesive compositions for use in die attach applications7 Aug 2014US 2014/0220337 A1Henkel US IP LLC
- Pressure Sensitive Adhesives Based on Renewable Resources, UV Curing and Related Methods27 Feb 2014US 2014/0057101 A1Avery Dennison Corporation
Most cited
By later US patents