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US 8,338,536 B2Granted
Adhesive compositions for use in die attach applications
AssigneeHenkel Corporation
InventorsMy Nguyen, Tadashi Takano, Puwei Liu
Life of this patent
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Abstract
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
Claims10
An adhesive composition, comprising:
- an epoxy resin component, at least a portion of which comprises a silane-modified epoxy resin;
- a curing agent;
- and
- a block copolymer additive comprising hydrophobic segments and hydrophilic segments,
- wherein the glass transition temperature of the block copolymer additive is between about 40° C. and 155° C.
2 more elements
Dependencies are inferred from the claim text.