Adhesive compositions for use in die attach applications
AssigneeHenkel US IP LLC
InventorsMy Nguyen, Tadashi Takano, Puwei Liu
Life of this patent
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Abstract
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
Claims12
An adhesive composition, comprising:
- a curable resin component;
- a curing agent;
- and
- a block copolymer additive comprising hydrophobic segments and hydrophilic segments, wherein the glass transition temperature of the block copolymer additive is at least about 40° C.;
- and
- a composition comprising:
- a first epoxy component;
- a second silane-modified epoxy component, wherein the second silane-modified epoxy component arises from reaction of an aromatic epoxy resin and an epoxy silane in a weight ratio of from about 1:10 to about 10:1,
- wherein the epoxy silane is embraced by the following structure:
- R1—Si(OR2)3
- wherein R1 is an oxirane-containing moiety and R2 is an alkyl or alkoxy-substituted alkyl, aryl or aralkyl group having from 1 to ten carbon atoms.
2-31. (canceled)
An assembly comprising a hydrophilic substrate and a partially cured adhesive composition, wherein the adhesive composition comprises a curable resin component, a curing agent, and a block copolymer additive comprising hydrophobic segments and hydrophilic segments, wherein the glass transition temperature of the additive is at least about 40° C., and a composition comprising:
- As component (A) an epoxy component embraced by the following structure:
- wherein Y may or may not be present and when Y present is a direct bond, CH2, CH(CH3)2, C═O, or S, R1 here is alkyl, alkenyl, hydroxy, carboxy and halogen, and x here is 1-4;
- As component (B) an epoxy-functionalized alkoxy silane embraced by the following structure:
- R1—Si(OR2)3 (VIII)
- where R1 is an oxirane-containing moiety and R2 is an alkyl or alkoxy-substituted alkyl, aryl, or aralkyl group having from one to ten carbon atoms;
- and
- As component (C) reaction products of components (A) and (B).
A composition of matter comprising:
- As component (A) an epoxy component embraced by the following structure:
- wherein Y may or may not be present and when Y present is a direct bond, CH2, CH(CH3)2, C═O, or S, R1 here is alkyl, alkenyl, hydroxy, carboxy and halogen, and x here is 1-4;
- As component (B) an epoxy-functionalized alkoxy silane embraced by the following structure:
- R1—Si(OR2)3 (VIII)
- wherein R1 is an oxirane-containing moiety and R2 is an alkyl or alkoxy-substituted alkyl, aryl, or aralkyl group having from one to ten carbon atoms;
- and
- As component (C) reaction products of components (A) and (B).
An adhesive composition, comprising:
- a curable resin component;
- a curing agent;
- and
- a block copolymer additive comprising hydrophobic segments and hydrophilic segments,
- wherein the glass transition temperature of the block copolymer additive is at least about 40° C.;
- and
- a composition comprising:
- an epoxy modified silane comprising:
- As component (A) an epoxy component embraced by the following structure:
- wherein Y may or may not be present and when Y present is a direct bond, CH2, CH(CH3)2, C═O, or S, R1 here is alkyl, alkenyl, hydroxy, carboxy and halogen, and x here is 1-4;
- As component (B) an epoxy-functionalized alkoxy silane embraced by the following structure:
- R1—Si(OR2)3 (VIII)
- where R1 is an oxirane-containing moiety and R2 is an alkyl or alkoxy-substituted alkyl, aryl, or aralkyl group having from one to ten carbon atoms;
- and
- As component (C) reaction products of components (A) and (B).
Dependencies are inferred from the claim text.