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US 8,835,574 B2Granted
Adhesive compositions for use in die attach applications
AssigneeHenkel IP & Holding GmbH
InventorsMy Nguyen, Tadashi Takano, Puwei Liu
Life of this patent
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Abstract
Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
Claims3
A composition comprising:
- a first epoxy component;
- a second silane-modified epoxy component, where the second component arises from reaction of an aromatic epoxy resin and an epoxy silane in a weight ratio of from about 1:10 to about 10:1, wherein the epoxy silane is embraced by the following structure:
- R1—Si(OR2)3
- wherein R1 is an oxirane-containing moiety and R2 is an alkyl or alkoxy-substituted alkyl, aryl or aralkyl group having from 1 to ten carbon atoms;
- a thermoplastic urethane;
- and
- diaminophenyl sulfone.
4 more elements
Dependencies are inferred from the claim text.