C08L 25/16
Homopolymers or copolymers of alkyl-substituted styrenes
C08L25/16 (Homopolymers or copolymers of alkyl-substituted styrenes) appears on 271 US grants and 203 published applications in this corpus.
Search patents in C08L- Granted patents
- 271
- Published applications
- 203
- Assignees
- 138
- Inventors
- 647
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 4 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 11 | 0 |
| 1986 | 5 | 0 |
| 1987 | 14 | 0 |
| 1988 | 10 | 0 |
| 1989 | 9 | 0 |
| 1990 | 2 | 0 |
| 1991 | 9 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 1 |
| 2003 | 3 | 2 |
| 2004 | 2 | 4 |
| 2005 | 1 | 7 |
| 2006 | 3 | 7 |
| 2007 | 3 | 5 |
| 2008 | 2 | 3 |
| 2009 | 3 | 1 |
| 2010 | 2 | 4 |
| 2011 | 1 | 7 |
| 2012 | 2 | 6 |
| 2013 | 1 | 1 |
| 2014 | 5 | 2 |
| 2015 | 4 | 5 |
| 2016 | 5 | 8 |
| 2017 | 5 | 20 |
| 2018 | 10 | 13 |
| 2019 | 20 | 13 |
| 2020 | 8 | 17 |
| 2021 | 10 | 17 |
| 2022 | 12 | 19 |
| 2023 | 11 | 16 |
| 2024 | 13 | 11 |
| 2025 | 14 | 7 |
| 2026 | 4 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition, insulating resin film and use thereof1 Sep 2026US 12,723,137 B2Shengyi Technology Co., Ltd.
- Styrenic copolymer composition with PMMA and improved weathering resistance10 Feb 2026US 12,545,779 B2Ineos Styrolution Group GmbH
- Flexible metal clad laminates and methods of preparation thereof10 Feb 2026US 12,545,780 B2Notark Corporation
- Sealant composition and pneumatic tire using same3 Feb 2026US 12,540,233 B2Toyo Tire Corporation
- Polymer compositions and products formed therewith30 Dec 2025US 12,509,572 B2Church & Dwight Co., Inc.
- Resin composition, prepreg, resin film, metal-clad laminated plate, printed wiring board, and semiconductor package1 Oct 2026US 2026/0297317 A1Resonac Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package24 Sep 2026US 2026/0286077 A1Resonac Corporation
- Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board16 Jul 2026US 2026/0201158 A1Panasonic Intellectual Property Management Co., Ltd.
- Recycled resin composition16 Jul 2026US 2026/0201160 A1LG Chem.Ltd.
- Resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package2 Jul 2026US 2026/0184835 A1Resonac Corporation
Most cited
By later US patents
- Elastomeric composition reinforced with a functionalized polyvinylaromatic filler125US 7,820,771 B2Michelin Recherche et Technique S. A. · 2010
- Polymeric films102US 4,778,697 AAmerican National Can Company · 1988
- Heat-resistant copolymer of alpha-methylstyrene and acrylonitrile, process for preparing the same, and thermoplastic resin composition containing the same66US 4,659,790 AJapan Synthetic Rubber Co., Ltd. · 1987
- Rubber-modified resin blends47US 4,904,730 AThe Dow Chemical Company · 1990
- Pneumatic tire with tread34US 7,671,132 B1The Goodyear Tire & Rubber Company · 2010