Resin composition, insulating resin film and use thereof
AssigneeShengyi Technology Co., Ltd.
InventorsCheng Luo, Shanyin Yan, Jiangling Zhang
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AssigneeShengyi Technology Co., Ltd.
InventorsCheng Luo, Shanyin Yan, Jiangling Zhang
Estimating the term…
Resin composition, insulating resin film and use thereof. The resin composition comprises the following components in parts by mass: 50-90 parts of a hydrogenated hydrocarbon resin and 10-50 parts of a benzocyclobutene resin; the benzocyclobutene resin comprises at least one structural unit A and at least one structural unit B. The hydrogenated hydrocarbon resin and the benzocyclobutene resin with a specific structure are both total-hydrocarbon structures, having low dielectric constant Dk, dielectric loss tangent Df, and water absorption rate. The benzocyclobutene resin can be thermally cured to obtain the high cross-linking density, high glass transition temperature, and excellent heat resistance. The resin composition and the insulating resin film prepared therewith have ultra-low dielectric constant and loss tangent, excellent dielectric properties, heat resistance, damp heat resistance, adhesion strength, and excellent mechanical properties such as flexibility, satisfying the performance requirements of electronic components being high frequency, high speed, and high integration.
A resin composition, comprising the following components in parts by mass:
Dependencies are inferred from the claim text.