Resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package
AssigneeResonac Corporation
InventorsShinichiro ABE, Yuji MATO, Yusuke SERA, Ai YOKOKURA, Daisuke FUJIMOTO, Tomohiko KOTAKE, Toshikatsu SHIMAZAKI
Life of this patent
Estimating the term…
Abstract
A resin composition containing a curable prepolymer which contains a vinylbenzyl group and an indene ring and has a weight average molecular weight of 50,000 or higher. Also provided is a prepreg, a resin film, a metal-clad laminate, a printed wiring board and a semiconductor package obtained using the resin composition.
Claims16
A resin composition comprising a curable prepolymer which contains a vinylbenzyl group and an indene ring and has a weight average molecular weight of 50,000 or higher.
A resin film comprising the resin composition according to claim lor a semi-cured product of the resin composition.
Dependencies are inferred from the claim text.