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US 2026/0201158 A1Published application
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHirosuke SAITO, Kenta KUBO
Life of this patent
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Abstract
An aspect of the present invention is a resin composition containing a maleimide compound (A) having an aromatic ring in a molecule and a maleimide equivalent of 500 g/mol or less; an imide compound (B) having a weight average molecular weight of 10,000 to 30,000 and a glass transition temperature of 50° C. or less; and a radical polymerizable compound (C).
Claims22
A resin composition comprising:
- a maleimide compound (A) having an aromatic ring in a molecule and a maleimide equivalent of 500 g/mol or less;
- an imide compound (B) having a weight average molecular weight of 10,000 to 30,000 and a glass transition temperature of 50° C. or less;
- and
- a radical polymerizable compound (C).
1 more element
Dependencies are inferred from the claim text.