C08K 5/5419
Containing at least one si—c bond
Official title: containing at least one Si—C bond
C08K5/5419 (Containing at least one si—c bond) appears on 986 US grants and 1,280 published applications in this corpus.
Search patents in C08K- Granted patents
- 986
- Published applications
- 1,280
- Assignees
- 553
- Inventors
- 3,258
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 5 | 0 |
| 1993 | 14 | 0 |
| 1994 | 10 | 0 |
| 1995 | 13 | 0 |
| 1996 | 14 | 0 |
| 1997 | 10 | 0 |
| 1998 | 6 | 0 |
| 1999 | 11 | 0 |
| 2000 | 10 | 0 |
| 2001 | 17 | 6 |
| 2002 | 25 | 19 |
| 2003 | 16 | 19 |
| 2004 | 13 | 14 |
| 2005 | 9 | 17 |
| 2006 | 14 | 21 |
| 2007 | 8 | 25 |
| 2008 | 10 | 23 |
| 2009 | 15 | 34 |
| 2010 | 27 | 44 |
| 2011 | 13 | 43 |
| 2012 | 20 | 41 |
| 2013 | 28 | 61 |
| 2014 | 55 | 66 |
| 2015 | 52 | 92 |
| 2016 | 55 | 60 |
| 2017 | 49 | 44 |
| 2018 | 39 | 72 |
| 2019 | 38 | 93 |
| 2020 | 62 | 84 |
| 2021 | 65 | 92 |
| 2022 | 45 | 67 |
| 2023 | 55 | 76 |
| 2024 | 48 | 56 |
| 2025 | 31 | 70 |
| 2026 | 33 | 41 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable composition, and cured coating, article, and method for forming coating using the same6 Oct 2026US 12,753,282 B2Threebond Co., Ltd.
- Curing agent, method of producing curing agent, and curable composition29 Sep 2026US 12,747,349 B2Dexerials Corporation
- Silicone emulsion and uses thereof29 Sep 2026US 12,747,353 B2Dow Silicones Corporation
- Coating composition, an article made thereof and a process for preparing the same29 Sep 2026US 12,747,362 B2Sherwin-Williams (Guangdong) New Material Co., Ltd.
- Block sponge and production process thereof8 Sep 2026US 12,729,267 B1Guangdong Eonjoy Technology Limited
- Thermal radical curable thermoconductive silicone composition, and method for producing same8 Oct 2026US 2026/0308329 A1Shin-Etsu Chemical Co., Ltd.
- Silicone composition8 Oct 2026US 2026/0308438 A1Shin-Etsu Chemical Co., Ltd.
- Thermally conductive silicone composition and production method therefor1 Oct 2026US 2026/0297411 A1Shin-Etsu Chemical Co., Ltd.
- Resin composition and electronic component device24 Sep 2026US 2026/0286121 A1Resonac Corporation
- Thermally conductive sheet and manufacturing method therefor17 Sep 2026US 2026/0282905 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Coupling agent compositions153US 4,689,085 ADow Corning Corporation · 1987
- Surface-segregatable, melt-extrudable thermoplastic composition84US 5,120,888 AKimberly-Clark Corporation · 1992
- Curable composition81US 4,837,274 AKanegafuchi Kagaku Kogyo Kabushiki Kaisha · 1989
- Polymeric materials with improved dielectric breakdown strength80US 6,879,861 B2Medtronic, Inc. · 2005
- Surface-segregatable, melt-extrudable thermoplastic composition75US 4,923,914 AKimberly-Clark Corporation · 1990