Thermally conductive sheet and manufacturing method therefor
AssigneeSekisui Chemical Co., Ltd.
InventorsKouji ASHIBA, Kenta KUROO, Takehiro DEROMACHI
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AssigneeSekisui Chemical Co., Ltd.
InventorsKouji ASHIBA, Kenta KUROO, Takehiro DEROMACHI
Estimating the term…
A heat conductive sheet (10) of the present invention includes a polymer matrix (12) and an anisotropic filler (13) oriented in the thickness direction, wherein the heat conductive sheet has a thickness of less than 0.2 mm, a void fraction in a cross-section (S2), which is parallel to a surface of the heat conductive sheet, located at a depth of 25 μm from the surface is 1.0 to 15.0%, and the heat conductive sheet includes a resin different from the polymer matrix in at least some of voids (14) on at least one surface of the heat conductive sheet. According to the present invention, it is possible to provide a thin heat conductive sheet, the heat conductive sheet having a low thermal resistance value and good adhesion to an adherend.
A heat conductive sheet comprising a polymer matrix and an anisotropic filler oriented in a thickness direction,
A method for producing a heat conductive sheet, comprising the steps of:
A heat conductive sheet comprising a polymer matrix and an anisotropic filler oriented in a thickness direction,
Use of a heat conductive sheet for adhering a semiconductor chip and a heat spreader in a reflow process, the heat conductive sheet comprising a polymer matrix and an anisotropic filler oriented in a thickness direction,
Dependencies are inferred from the claim text.