C08J 5/249
Characterised by the additives used in the prepolymer mixture
Official title: {characterised by the additives used in the prepolymer mixture}
C08J5/249 (Characterised by the additives used in the prepolymer mixture) appears on 1,080 US grants and 1,498 published applications in this corpus.
Search patents in C08J- Granted patents
- 1,080
- Published applications
- 1,498
- Assignees
- 482
- Inventors
- 2,755
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 6 | 0 |
| 1980 | 1 | 0 |
| 1981 | 9 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 1 | 0 |
| 1987 | 6 | 0 |
| 1988 | 18 | 0 |
| 1989 | 22 | 0 |
| 1990 | 31 | 0 |
| 1991 | 13 | 0 |
| 1992 | 13 | 0 |
| 1993 | 9 | 0 |
| 1994 | 7 | 0 |
| 1995 | 7 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 7 | 1 |
| 2002 | 4 | 5 |
| 2003 | 11 | 5 |
| 2004 | 3 | 6 |
| 2005 | 2 | 11 |
| 2006 | 1 | 11 |
| 2007 | 5 | 8 |
| 2008 | 4 | 21 |
| 2009 | 7 | 33 |
| 2010 | 11 | 58 |
| 2011 | 29 | 57 |
| 2012 | 33 | 51 |
| 2013 | 23 | 82 |
| 2014 | 31 | 88 |
| 2015 | 47 | 93 |
| 2016 | 43 | 100 |
| 2017 | 63 | 89 |
| 2018 | 71 | 109 |
| 2019 | 66 | 85 |
| 2020 | 79 | 115 |
| 2021 | 83 | 99 |
| 2022 | 57 | 79 |
| 2023 | 52 | 81 |
| 2024 | 57 | 82 |
| 2025 | 53 | 73 |
| 2026 | 39 | 56 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-cladded laminate board, and wiring board22 Sep 2026US 12,742,047 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition and prepreg, film with resin, metal foil with resin, metal-clad laminated plate, and wiring board using same15 Sep 2026US 12,735,543 B2Panasonic Intellectual Property Management Co., Ltd.
- High-performance composite panel and manufacturing method8 Sep 2026US 12,729,277 B2The United States of America as represented by the Secretary of the Army
- Resin composition, insulating resin film and use thereof1 Sep 2026US 12,723,137 B2Shengyi Technology Co., Ltd.
- Epoxy-based resin composition for clear fiber composites and epoxy-based clear fiber composites18 Aug 2026US 12,709,668 B2Kaneka Americas Holding, Inc.
- Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board10 Sep 2026US 2026/0264367 A1Panasonic Intellectual Property Management Co., Ltd.
- Prepreg, metal-clad laminate, and wiring board10 Sep 2026US 2026/0264370 A1Panasonic Intellectual Property Management Co., Ltd.
- Resin composition, and prepreg and use thereof10 Sep 2026US 2026/0265473 A1Guangdong Hinno-Tech Co., Ltd.
- Molded Article Comprising Thermoplastic Continuous Fiber Reinforced Woven Composite, and Method for Manufacturing Same10 Sep 2026US 2026/0265475 A1Lotte Chemical Corporation
- Recycleable bioplastic composites, methods of manufacture thereof and articles comprising the same27 Aug 2026US 2026/0250510 A1University of Connecticut
Most cited
By later US patents
- Luminescent gel coats and moldable resins190US 6,207,077 B1Orion 21 A.D. PTY LTD · 2001
- Two-component binder for exterior fiberboard87US 4,165,305 AAllied Chemical Corporation · 1979
- Flame retardant, low dielectric constant microsphere filled laminate87US 5,126,192 AInternational Business Machines Corporation · 1992
- Prepreg for printed circuit board and substrate for printed circuit using said prepreg82US 5,733,823 AIdemitsu Petrochemical Co., Ltd. · 1998
- Method of preparing fiber/resin composites78US 5,679,719 ALoctite Corporation · 1997