C08J 2361/14
Modified phenol-aldehyde condensates
C08J2361/14 (Modified phenol-aldehyde condensates) appears on 21 US grants and 29 published applications in this corpus.
Search patents in C08J- Granted patents
- 21
- Published applications
- 29
- Assignees
- 27
- Inventors
- 75
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 0 | 3 |
| 2016 | 4 | 4 |
| 2017 | 1 | 2 |
| 2018 | 3 | 2 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 3 |
| 2022 | 0 | 1 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of reducing the formaldehyde emission of a mineral fiber product, and mineral fiber product with reduced formaldehyde emission17 Feb 2026US 12,553,235 B2Rockwool A/S
- Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board19 Sep 2023US 11,760,871 B2Mitsubishi Gas Chemical Company, Inc.
- Thermosetting resin composition23 Jun 2020US 10,689,493 B2Showa Denko K. K.
- Flame-retardant, high temperature resistant thermosets on the basis of naphthalene-based epoxy resins and cyanate esters18 Sep 2018US 10,077,359 B2Airbus Defence and Space GmbH
- Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate27 Feb 2018US 9,907,166 B2Mitsubishi Gas Chemical Company, Inc.
- Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board18 Jun 2026US 2026/0167815 A1Mitsubishi Gas Chemical Company, Inc.
- Method of reducing the formaldehyde emission of a mineral fiber product, and mineral fiber product with reduced formaldehyde emission21 May 2026US 2026/0139472 A1Rockwool A/S
- Curable resin, curable resin composition, and cured product14 May 2026US 2026/0132242 A1DIC Corporation
- Curable resin, curable resin composition, cured product, prepreg, laminate, and semiconductor substrate30 Apr 2026US 2026/0117059 A1Nippon Kayaku Kabushiki Kaisha
- Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor package23 Oct 2025US 2025/0326929 A1Resonac Corporation
Most cited
By later US patents
- High temperature three dimensional printing compositions65US 9,708,440 B2Novoset, LLC · 2017
- High temperature three-dimensional printing compositions41US 9,873,761 B1Novoset, LLC · 2018
- Spray-dried phenolic adhesives18US 4,098,770 AReichhold Chemicals, Inc. · 1978
- Stable aqueous dispersions of hydrophilic phenolic resins having low xylenol and bisphenol-A content12US 7,442,741 B2Georgia-Pacific Chemicals LLC · 2008
- Method of preparing phenolaldehyde foamed plastics9US 3,998,765 A1976