Thermosetting resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board

A thermosetting resin composition comprising

• a thermosetting resin (A) containing a cyanate ester compound (D),
• boron nitride (B), and
• a dispersant (C) with a pH of 8 or higher, the dispersant (C) having a block chain (i) including a repeating unit represented by Formula [i]:
• where, in Formula [i]:
• R101 represents a hydrogen atom or an alkyl group,
• X101 represents —NH— or —O—,
• Y101 represents a divalent linking group,
• R102 to R104 each independently represent an alkyl group, an arylalkyl group, or a heteroarylalkyl group, and
• Z− represents a counter anion;
• wherein
• the cyanate ester compound (D) contains one or more selected from the group consisting of:
• a naphthol aralkyl cyanate ester compound represented by Formula (1):
• where each R1 independently represents a hydrogen atom or a methyl group, and n1 represents an integer from 1 to 50,
• a biphenyl aralkyl cyanate ester compound represented by Formula (2):
• where each R3 independently represents a hydrogen atom or a methyl group, and n3 represents an integer from 1 to 50, and
• a diallyl bisphenol A cyanate ester compound represented by Formula (3):