C08G 73/125
The unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen
Official title: {the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain}
C08G73/125 (The unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen) appears on 113 US grants and 35 published applications in this corpus.
Search patents in C08G- Granted patents
- 113
- Published applications
- 35
- Assignees
- 56
- Inventors
- 219
- Latest grant
- 30 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 15 | 0 |
| 1992 | 9 | 0 |
| 1993 | 9 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 1 | 4 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 2 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 2 | 2 |
| 2012 | 1 | 1 |
| 2013 | 2 | 4 |
| 2014 | 0 | 0 |
| 2015 | 3 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 3 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 3 | 1 |
| 2021 | 1 | 2 |
| 2022 | 2 | 2 |
| 2023 | 1 | 2 |
| 2024 | 2 | 1 |
| 2025 | 1 | 5 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Adhesive composition, adhesive tape, and method for processing electronic component30 Dec 2025US 12,509,612 B2Sekisui Chemical Co., Ltd.
- Biofunctional hydrogel for wound healing24 Sep 2024US 12,097,300 B2Nanyang Technological University
- Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device20 Feb 2024US 11,905,356 B2Nippon Kayaku Kabushiki Kaisha
- Siloxane compound and polyimide precursor composition comprising same21 Nov 2023US 11,820,785 B2LG Chem.Ltd.
- Resin composition and article made therefrom6 Dec 2022US 11,518,882 B1Elite Electronic Material (Zhongshan) Co., Ltd.
- Resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board, and semiconductor package13 Aug 2026US 2026/0234400 A1Resonac Corporation
- Reprocessable and degradable bismaleimide resin16 Jul 2026US 2026/0201114 A1Soochow University
- Resin composition and prepreg and metal clad laminate including the same9 Jul 2026US 2026/0193419 A1Nan Ya Plastics Corporation
- Insulating resin composition and article made therefrom30 Apr 2026US 2026/0117065 A1Elite Electronic Material (Kunshan) Co., Ltd.
- Modified bismaleimide prepolymer, resin composition and application of resin composition1 May 2025US 2025/0136761 A1Shengyi Technology (Changshu) Co., Ltd
Most cited
By later US patents
- Polymer from substituted, unsaturated, bicyclic imide48US 4,604,437 ACiba-Geigy Corporation · 1986
- Imide-linked maleimide and polymaleimide compounds38US 7,208,566 B2Designer Molecules, Inc. · 2007
- Allyl or methallyl-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid imides and bisimides34US 4,515,962 ACiba-Geigy Corporation · 1985
- Polyetherimides prepared by self-condensation of hydroxyaryl phthalimide salts32US 4,297,474 AGeneral Electric Company · 1981
- Curable cycloaliphatic epoxy-polyimide compositions31US 4,273,916 ATRW Inc. · 1981