Resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board, and semiconductor package

Abstract

Provided is a resin composition containing an acrylic polymer serving as a combustible component, the resin composition having excellent flame resistance with satisfactory adhesion strength to a copper foil and desmear resistance maintained. Further, a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition are provided. The resin composition is specifically a resin composition containing an acrylic polymer (A), a thermosetting resin (B), and an inorganic filler (C) surface-treated with a silane coupling agent, further containing a silane coupling agent (D).

Dependencies are inferred from the claim text.