Insulating resin composition and article made therefrom

Abstract

The present disclosure discloses an insulating resin composition, comprising: component (A): 100 parts by weight of an unsaturated carbon-carbon double bond-containing polyphenylene ether resin and/or a maleimide resin, and component (B): 10 to 65 parts by weight of a phosphorus-containing monomer represented by formula (1). In Formula (1), Rn is a C2 to C4 alkenyl-substituted phenyl group, and each of R12 and R13 is independently a C1 to C4 alkyl, a C2 to C4 alkenyl, a phenyl, a C1 to C4 alkyl-substituted phenyl, a C2 to C4 alkenyl-substituted phenyl, a biphenyl or a naphthyl. Besides, the present disclosure also discloses an article made from the insulating resin composition, including prepreg, resin film, metal foil-clad laminate or printed circuit board. The article has improvements in at least one properties including inner resin flow, edge stripe, flame resistance, peel strength, dissipation factor, and Z-axis percent of thermal expansion.

Dependencies are inferred from the claim text.