C08G 59/3281
Containing silicon
Official title: {containing silicon}
C08G59/3281 (Containing silicon) appears on 74 US grants and 111 published applications in this corpus.
Search patents in C08G- Granted patents
- 74
- Published applications
- 111
- Assignees
- 66
- Inventors
- 269
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 3 |
| 2012 | 0 | 1 |
| 2013 | 2 | 1 |
| 2014 | 1 | 1 |
| 2015 | 2 | 7 |
| 2016 | 0 | 11 |
| 2017 | 6 | 7 |
| 2018 | 8 | 10 |
| 2019 | 6 | 10 |
| 2020 | 10 | 10 |
| 2021 | 10 | 10 |
| 2022 | 5 | 10 |
| 2023 | 7 | 7 |
| 2024 | 9 | 10 |
| 2025 | 4 | 4 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Curable composition28 Jul 2026US 12,692,341 B2Daicel Corporation
- Polyimide precursor composition and optical multilayer structure formed using the same19 May 2026US 12,630,739 B2SK Innovation Co., Ltd.
- Adhesive composition and film-shaped sealing material24 Mar 2026US 12,584,050 B2Shin-Etsu Chemical Co., Ltd.
- Photosensitive resin composition, photosensitive dry film, and pattern formation method9 Dec 2025US 12,493,244 B2Shin-Etsu Chemical Co., Ltd.
- Epoxy resin, preparing method thereof, epoxy composition comprising the same, and use thereof15 Jul 2025US 12,359,057 B2Korea Institute of Industrial Technology
- Conductive silicone rubber composition and cured product thereof6 Aug 2026US 2026/0226237 A1Shin-Etsu Chemical Co., Ltd.
- Recyclable and reworkable epoxy resins18 Jun 2026US 2026/0167766 A1Aditya Birla Chemicals (Thailand) Ltd. (Epoxy Division)
- Heat-curable composition, cured article, adhesive agent, and heat-curable composition production method4 Jun 2026US 2026/0152600 A1Kagoshima University
- Release agent composition for light irradiation release, and adhesive composition for light irradiation release9 Apr 2026US 2026/0098188 A1Nissan Chemical Corporation
- Organic silicon resin toughening agent, single-component high-strength epoxy structural adhesive, and preparation methods for both26 Mar 2026US 2026/0085217 A1Guangdong Baiyun Technology Co., Ltd.
Most cited
By later US patents
- Room-temperature curable epoxy resin composition22US 5,344,890 ANippon Paint Co., Ltd. · 1994
- Epoxy compound having alkoxysilyl group, method for preparing the same, composition including the same, cured product made from the composition, and use of the composition7US 9,725,590 B2Korea Institute of Industrial Technology · 2017
- Epoxy siloxane coating compositions6US 8,846,827 B2PPG Industries Ohio, Inc. · 2014
- Hard coating film using composition including epoxy siloxane resin and preparing method thereof4US 10,377,919 B2Korea Advanced Institute of Science and Technology · 2019
- Hard coating composition and flexible display device including the hard coating composition3US 10,793,747 B2Samsung Display Co., Ltd. · 2020