C08F 290/064
Polymers containing more than one epoxy group per molecule
Official title: {Polymers containing more than one epoxy group per molecule}
C08F290/064 (Polymers containing more than one epoxy group per molecule) appears on 120 US grants and 120 published applications in this corpus.
Search patents in C08F- Granted patents
- 120
- Published applications
- 120
- Assignees
- 108
- Inventors
- 406
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 5 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 0 |
| 2002 | 8 | 6 |
| 2003 | 3 | 7 |
| 2004 | 6 | 11 |
| 2005 | 4 | 10 |
| 2006 | 5 | 6 |
| 2007 | 1 | 3 |
| 2008 | 2 | 3 |
| 2009 | 2 | 13 |
| 2010 | 6 | 5 |
| 2011 | 6 | 5 |
| 2012 | 4 | 4 |
| 2013 | 1 | 1 |
| 2014 | 5 | 4 |
| 2015 | 2 | 0 |
| 2016 | 0 | 2 |
| 2017 | 0 | 1 |
| 2018 | 2 | 3 |
| 2019 | 2 | 4 |
| 2020 | 3 | 3 |
| 2021 | 1 | 6 |
| 2022 | 4 | 6 |
| 2023 | 2 | 7 |
| 2024 | 3 | 3 |
| 2025 | 3 | 5 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition, dry film, printed wiring board, and method for producing printed wiring board14 Jul 2026US 12,681,386 B2Resonac Corporation
- Resin composition, secondary coating material for optical fiber, optical fiber, and method for manufacturing optical fiber20 Jan 2026US 12,528,926 B2Sumitomo Electric Industries, Ltd.
- Active-energy-ray-curable resin composition and cured product thereof13 Jan 2026US 12,522,684 B2Nippon Shokubai Co., Ltd.
- Thermosetting compositions and forming three-dimensional objects therefrom5 Aug 2025US 12,378,425 B2Stratasys, Inc.
- Radical-polymerizable adhesive composition for laminating and bonding steel plates, adhesive laminate, motor, and method for manufacturing adhesive laminate10 Jun 2025US 12,325,811 B2Threebond Co., Ltd.
- Thermally conductive dielectric coatings16 Jul 2026US 2026/0201237 A1Henkel AG & Co. KGaA
- Photocurable composition and its application in photocuring fields26 Feb 2026US 2026/0055222 A1Huizhou Huahong New Materials Co., Ltd.
- Alkali-soluble resin, alkali-soluble resin composition and method for producing same28 Aug 2025US 2025/0270365 A1Nippon Shokubai Co., Ltd.
- Photocurable and combustible composition and use thereof24 Jul 2025US 2025/0236568 A1Xi'an Modern Chemistry Research Institute
- Anaerobically curable compositions19 Jun 2025US 2025/0197690 A1Henkel AG & Co. KGaA
Most cited
By later US patents
- Fumarate and fumaramide siloxane hydrogel compositions72US 5,496,871 ABausch & Lomb Incorporated · 1996
- Radiation curable coating for photographic laminate70US 4,786,586 AMorton Thiokol, Inc. · 1988
- Covalently crosslinked water-absorbent graft copolymer56US 5,726,250 AAdhesives Research, Inc. · 1998
- Fumaramide siloxane hydrogel compositions48US 5,420,324 ABausch & Lomb Incorporated · 1995
- Fumarate and fumaramide siloxane hydrogel compositions47US 5,374,662 ABausch & Lomb Incorporated · 1994