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US 2026/0055222 A1Published application
Photocurable composition and its application in photocuring fields
AssigneeHuizhou Huahong New Materials Co., Ltd.
InventorsJianxiong LIN, Qiang LIU, Xuefei ZHENG, Akira SHIRAHATA, Nobuo KABAMOTO, Yumi SAITO, Jianyu YANG
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Abstract
The present invention generally relates to a photosensitive material. More particularly it relates to a photosensitive composition comprising a photoinitiator compound having a structure (I) and at least one monomer/oligomer wherein the monomer/oligomer is having photopolymerizable ethylenic unsaturated double bonds and its application in the field of photosensitive curing.
Claims15
A photosensitive composition, comprising:
- (i) a photoinitiator compound having the following structure:
- and at least one monomer/oligomer wherein the monomer/oligomer is having photopolymerizable ethylenic unsaturated double bonds;
- wherein the photoinitiator compound present is in the range of 1-14% of the weight of the photosensitive composition.
Dependencies are inferred from the claim text.