C04B 37/045
Characterised by the interlayer used
Official title: {characterised by the interlayer used (C04B37/047 takes precedence)}
C04B37/045 (Characterised by the interlayer used) appears on 53 US grants and 56 published applications in this corpus.
Search patents in C04B- Granted patents
- 53
- Published applications
- 56
- Assignees
- 50
- Inventors
- 179
- Latest grant
- 24 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 4 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 2 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 3 |
| 2008 | 0 | 0 |
| 2009 | 0 | 4 |
| 2010 | 2 | 3 |
| 2011 | 2 | 1 |
| 2012 | 3 | 0 |
| 2013 | 0 | 2 |
| 2014 | 1 | 3 |
| 2015 | 0 | 3 |
| 2016 | 2 | 1 |
| 2017 | 2 | 7 |
| 2018 | 1 | 4 |
| 2019 | 1 | 5 |
| 2020 | 3 | 1 |
| 2021 | 2 | 2 |
| 2022 | 1 | 2 |
| 2023 | 2 | 6 |
| 2024 | 4 | 2 |
| 2025 | 2 | 2 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for atomic diffusion bonding and bonded structure24 Mar 2026US 12,583,204 B2Canon Anelva Corporation
- Electronic device housing, manufacturing method thereof, and electronic device5 Aug 2025US 12,382,600 B2BYD Company Limited
- Method for integrally bonding a glass element to a support element, and optical device24 Jun 2025US 12,338,183 B2JENOPTIK Optical Systems GmbH
- Ceramic package for quantum computing and method for preparation29 Oct 2024US 12,128,652 B2Hefei Shengda Electronics Technology Industry Co., Ltd.
- Electronic device housing, electronic device, and compound body27 Aug 2024US 12,075,583 B2BYD Company Limited
- Method of forming articles comprising temporary bonding of substrates14 May 2026US 2026/0131564 A1Corning Incorporated
- Glass bottom ceramic vessel14 Aug 2025US 2025/0255422 A1
- Lightweight optics17 Jul 2025US 2025/0231328 A1Gooch and Housego PLC
- Method for integrally bonding a glass element to a support element, and optical device17 Oct 2024US 2024/0343654 A1JENOPTIK Optical Systems GmbH
- Ceramic package for quantum computing and method for preparation12 Sep 2024US 2024/0300219 A1Hefei Shengda Electronics Technology Industry Co., Ltd.
Most cited
By later US patents
- Low temperature reaction bonding104US 5,427,638 AAlliedSignal Inc. · 1995
- Field-assisted sealing32US 5,747,169 ADavid Sarnoff Research Center, Inc. · 1998
- Method for manufacturing an electrodeless lamp30US 6,666,739 B2Ceravision Technology Limited · 2003
- Laminated ceramic structure26US 4,719,151 ACorning Glass Works · 1988
- Glass sealed products24US 4,002,799 ATechnology Glass Corporation · 1977