Ceramic package for quantum computing and method for preparation

A ceramic package for quantum computing, comprising a first light window, a first ceramic plate, a vacuum tube, a second ceramic plate, and a second light window connected sequentially from bottom to top, wherein the first light window is installed on the first ceramic plate, the second light window is installed on the second ceramic plate, and the vacuum tube has a signal inlet and a signal outlet, the first light window and the second light window cover the signal inlet and the signal outlet of the vacuum tube, respectively;

• a side of the first ceramic plate is provided with a lead wire, wherein the side is opposite to other side of the first ceramic plate connected with the vacuum tube and the lead wire configured to lead a signal into a system;
• the first ceramic plate is provided with a first through hole in a middle of the first ceramic plate, the second ceramic plate is provided with a second through hole in a middle of the second ceramic plate, the first light window covers the first through hole, the second light window covers the second through hole, the first through hole, the vacuum tube, and the second through hole are coaxially arranged;
• the vacuum tube and the first ceramic plate are connected by a first solder sheet, and the vacuum tube and the second ceramic plate are connected by another first solder sheet;
• the first light window and the first through hole are connected by a second solder sheet, and the second light window and the second through hole are connected by another second solder;
• the first ceramic plate and the second ceramic plate are both aluminum nitride ceramic plates;
• the first solder sheet is a silver-copper solder sheet and the second solder sheet is a gold-tin solder sheet;
• and
• a size of the first ceramic plate is larger than a size of the second ceramic plate.