Method for atomic diffusion bonding and bonded structure
AssigneesTohoku University, Canon Anelva Corporation
InventorsTakehito Shimatsu, Miyuki Uomoto, Kazuo Miyamoto, Yoshikazu Miyamoto, Nobuhiko Katoh, Takayuki Moriwaki, Takayuki Saitoh
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Abstract
Atomic diffusion bonding is carried out using a bonding film comprising a nitride formed at a bonding surface. Operating in a vacuum chamber, a bonding film comprising a nitride is formed on each of flat surfaces of two substrates that each have the flat surface, and, by overlapping the two substrates so the bonding films formed on the two substrates are in contact with each other, the two substrates are joined by the generation of atomic diffusion at a bonding interface between the bonding films.
Claims30
An atomic diffusion bonding method comprising, in a vacuum vessel, forming a bonding film comprising a nitride with a microcrystalline or amorphous structure on each of smooth surfaces of two base materials each having the smooth surface, then, without performing any other treatment on the bonding films comprising the nitride with the microcrystalline or amorphous structure formed in the vacuum vessel, overlaying the two base materials with each other so that the bonding films formed on the two base materials are in contact with each other, thereby causing atomic diffusion at a bonding interface between the bonding films to bond the two base materials.
An atomic diffusion bonding method comprising, in a vacuum vessel, forming a bonding film comprising a nitride with a microcrystalline or amorphous structure on a smooth surface of one base material, then, without performing any other treatment on the bonding film comprising the nitride with the microcrystalline or amorphous structure formed in the vacuum vessel, overlaying the one base material with the other base material having a smooth surface with a nitride thin film with a microcrystalline or amorphous structure at least on the surface so that the bonding film formed on the one base material contacts the smooth surface of the other base material, thereby causing atomic diffusion at a bonding interface between the bonding film and the smooth surface of the other base material to bond the two base materials.
An atomic diffusion bonding method comprising, in a vacuum vessel, forming a bonding film comprising a nitride with a microcrystalline or amorphous structure on a smooth surface of one base material, then, without performing any other treatment on the bonding film comprising the nitride with the microcrystalline or amorphous structure formed in the vacuum vessel, overlaying the one base material with the other base material having an activated smooth surface so that the bonding film formed on the one base material contacts the smooth surface of the other base material, thereby causing atomic diffusion at a bonding interface between the bonding film and the smooth surface of the other base material to bond the two base materials.
Dependencies are inferred from the claim text.