Field-assisted sealing
AssigneeDavid Sarnoff Research Center, Inc.
InventorsZhong Hui-Hugh Fan, Aaron William Levine, Satyam Choudary Cherukuri, Steven A. Lipp
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Abstract
The invention provides a method of bonding a glass substrate and a nonconductive substrate comprising the steps of: (a) contacting a surface of the nonconductive substrate which is coated with a field-assist bonding material with a conforming surface of the glass substrate; and (b) applying sufficient heat to the two substrates and sufficient voltage across the two substrates to bond the two substrates together.
Claims22
A method of bonding a glass substrate and a nonconductive substrate, wherein each substrate has a thickness of at least about 0.1 mm, comprising the steps of:
- (a) uniformly coating a surface of the nonconductive substrate with a field-assist bonding material;
- (b) contacting the coated surface with a conforming surface of the glass substrate;
- (c) heating the two substrates to a temperature no more than about 100.degree. C. below the lowest annealing temperature of the two substrates;
- and (d) applying a voltage across the two substrates that is effective to accelerate the formation of the bond between the two substrates.
A method of bonding a glass substrate and a nonconductive substrate, wherein each substrate has a thickness of at least about 0.1 mm, comprising the steps of:
- (a) uniformly coating a surface of the nonconductive substrate with silicon;
- (b) contacting the coated surface with a conforming surface of the glass substrate;
- (c) heating the two substrates to a temperature no more than about 50.degree. C. below the lowest annealing temperature of the two substrates;
- and (d) applying a voltage across the two substrates that is effective to accelerate the formation of the bond between the two substrates.
A method of completing and preserving liquid-handling structures of capillary dimensions, which liquid-handling structures are formed in a surface of a glass substrate or of a nonconductive substrate, the method acting to enclose the liquid-handling structures by bonding the glass surface to a surface of a nonconductive substrate, the method comprising the steps of:
- (a) contacting (1) the surface of the nonconductive substrate, which is coated with a field-assist bonding material, with (2) the glass surface that is to be bonded;
- and
- (b) applying sufficient heat to the two substrates and sufficient voltage across the two substrates to bond the two substrates together, wherein the voltage applied is effective to accelerate the bonding process.
A glass structure formed of a first glass substrate and a second glass substrate hermetically bonded together, each glass substrate having a thickness of at least about 0.1 mm, wherein there is a uniformly applied layer of silicon interposed between the glass substrates.
Dependencies are inferred from the claim text.